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Optical module, circuit board and its electronic machine

A technology of optical modules and substrates, applied in circuits, electrical solid-state devices, televisions, etc.

Inactive Publication Date: 2006-09-13
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the conventional solid-state imaging device, in order to protect the sensor chip and electrical connection parts from moisture, it is necessary to adopt a sealed frame structure, which increases the size of the device

Method used

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  • Optical module, circuit board and its electronic machine
  • Optical module, circuit board and its electronic machine
  • Optical module, circuit board and its electronic machine

Examples

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Embodiment Construction

[0046] Embodiments of the present invention will be described below with reference to the drawings.

[0047] figure 1 A diagram showing an optical module and a circuit board according to an embodiment of the present invention. The optical module has an optical chip 10 . 2(A) and 2(B) are a cross-sectional view and a plan view of the optical chip.

[0048] The optical chip 10 has an optical portion 12 which is a portion where light is incident or emitted. In addition, the optical part 12 converts light energy into other energy (such as electrical energy). That is, the optical section 12 includes a plurality of energy conversion elements (light receiving elements, light emitting elements) 14 . In the present embodiment, the optical section 12 is a light receiving section. A plurality of energy conversion elements (light receiving elements or image sensor elements) 14 are arranged in a two-dimensional array to perform image sensing. That is to say, in this embodiment, the o...

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PUM

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Abstract

An optical chip having an optical section and an electrode is formed above a substrate. The optical chip is surrounded by a body. The optical section is sealed by a first seal section. An electrical connection portion between the electrode of the optical chip and an interconnecting line of the substrate is sealed by a second seal section.

Description

technical field [0001] The invention relates to an optical module, a circuit board and an electronic machine thereof. Background technique [0002] There is known a solid-state imaging device in which a sensor chip is mounted on a housing and a lens is mounted on the housing. In a conventional solid-state imaging device, in order to protect a sensor chip, an electrical connection part, and the like from moisture, it is necessary to employ a sealed housing structure, which increases the size of the device. Contents of the invention [0003] An object of the present invention is to provide an optical module, a circuit board, and an electronic device having a miniaturized sealing structure. [0004] (1) The optical module related to the present invention includes [0005] The substrate on which the wiring is installed, [0006] An optical chip provided above the substrate, an optical chip including an optical portion and an electrode electrically connected to the wiring, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/14H04N5/335H01L23/10H01L27/146H01L31/02H01L31/0203H01L31/0216H01L31/0232H04N25/00
CPCH01L27/14618H01L31/0203H01L2224/16H01L27/14627H01L31/0232H01L23/10H01L31/02162H04N5/2257H01L2224/48227H01L2224/05573H01L2224/05567H01L31/02325H04N23/57H01L2224/48091H01L2924/00014
Inventor 桥元伸晃
Owner SEIKO EPSON CORP
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