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Highly effective liquid cooling heat sink for computer

A liquid-cooled heat dissipation, computer technology, applied in computing, instruments, electrical and digital data processing, etc., can solve the problems of low heat dissipation power, vibration noise, difficult to meet, etc., to achieve high heat dissipation power, low power consumption, and good heat dissipation effect. Effect

Inactive Publication Date: 2006-11-01
夏宏
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The operating temperature of the computer CPU is related to the working stability and service life of the computer. Usually, in order to reduce the heat and dissipate heat, most of them use fans to cool it and discharge the heat to the outside of the chassis. The heat dissipation power is small, the effect is poor, and there is vibration and noise. , it is difficult to meet the needs of the rapid development of computer technology

Method used

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  • Highly effective liquid cooling heat sink for computer
  • Highly effective liquid cooling heat sink for computer
  • Highly effective liquid cooling heat sink for computer

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Embodiment Construction

[0011] Embodiments of the present invention will be described below with reference to the drawings. Such as figure 1 , figure 2 , image 3 , Figure 4 As shown, a high-efficiency liquid cooling heat dissipation device for computers is characterized in that it includes a heat conductor 1 with a multi-slot circuit, a two-chamber tube-and-band radiator 2, a circulation pump 3, an electric fan 4, and a liquid transmission hose 5- 1, 5-2 and connecting pipes, the upper and lower parts of the two-chamber tube-and-band radiator 2 are provided with water chambers, and the middle part of each water chamber is provided with a partition 7 that separates the water chamber into left and right parts. Chamber and the lower water chamber are vertically provided with pipeline 8, and the upper left and right water chambers 11-1, 11-2 of the two-chamber tube-band radiator are connected with the liquid transfer hoses 5-1, 5-2 respectively. One end is connected, and the other ends of the liqu...

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Abstract

The invention relates to a high-efficiency liquid cooling heat dissipation device for computers, which has a heat conductor with a multi-slot circuit, a two-chamber pipe-belt radiator, a circulation pump, an electric fan, a liquid transmission hose and a connecting pipe, and a two-chamber pipe-belt heat sink There are water chambers on the upper and lower parts of the device, and partitions in the middle of each water chamber. Pipelines are arranged vertically between the upper and lower water chambers. The upper left and right water chambers of the two-chamber tube-belt radiator are equipped with liquid transmission hoses and The upper part of the heat conductor with a multi-slot circuit is connected, the upper middle of the heat transfer device with a multi-slot circuit is provided with a partition, the lower part is provided with a liquid flow return tank, and the circulation pump is fixed on the top, bottom or left and right of the two-chamber tube-and-belt radiator On the side, the inlet and outlet ends of the circulating pump are respectively fixedly connected with the left water chamber and the right water chamber of the lower part of the two-chamber tube-band radiator through connecting pipes, and an electric fan is installed in the middle of the two-chamber tube-band radiator. The radiator, circulation pump and electric fan are integrated, small in size, simple in structure, easy to install and use, high in cooling power, good in cooling effect, free of vibration and noise, and can reliably guarantee the working stability and service life of the computer.

Description

1. Technical field [0001] The invention relates to a device for cooling computer heating objects, in particular to a high-efficiency liquid cooling heat dissipation device for computers. 2. Background technology [0002] With the continuous development of science and technology and the increasing innovation of information technology, computers have become more and more widely used. With the continuous improvement of computer CPU work efficiency, the power consumption is getting bigger and bigger, so the calorific value of its chip rises significantly. The operating temperature of the computer CPU is related to the working stability and service life of the computer. Usually, in order to reduce the heat and dissipate heat, most of them use fans to cool it and discharge the heat to the outside of the chassis. The heat dissipation power is small, the effect is poor, and there is vibration and noise. , it is difficult to meet the needs of the rapid development of computer techno...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20H01L23/473
Inventor 夏宏
Owner 夏宏