6results about How to "High cooling power" patented technology

The embodiment of the utility model provides a compression device capable of dissipating heat through air cooling. The compression device comprises a box body, a cooling unit and at least one compressor unit, wherein an air inlet and an air outlet located in one side of the air inlet are formed in the top of the box body; the at least one compressor unit is arranged in the box body and is used for compressing gas; the cooling unit comprises a cooling cabin, a fan assembly and a plurality of coolers; the cooling cabin is arranged in the box body and is positioned below the air outlet; at least one side wall of the cooling cabin is formed by at least one of the plurality of coolers along the vertically arranged cooler, at least part of the bottom wall of the cooling cabin is formed by at least one of the plurality of coolers along the transversely arranged cooler, and the plurality of coolers are respectively connected with the compressor unit; and the fan assembly is arranged on the top wall of the cooling cabin and is opposite to the air outlet, and the fan assembly is used for guiding airflow to flow into the box body from the air inlet and flow through the multiple coolers so as to cool the compressor unit.

This invention relates to a brake disc optimization method, device, and medium based on four-factor constraints. The method includes: obtaining the mass of a target brake disc; establishing a model with an undercarriage structure based on the parameters of the target brake disc, and obtaining the maximum limiting temperature of each part; performing optimization design without exceeding the original mass to obtain the optimized brake disc; performing CFD steady-state simulation to calculate the steady-state cooling pump air ratio; when the maximum temperature is lower than the maximum limiting temperature, determining whether it meets the preset optimization target based on the steady-state cooling pump air ratio; performing CFD transient simulation analysis on candidate brake discs to calculate the transient cooling pump air ratio; when the maximum temperature is lower than the maximum limiting temperature, determining whether it meets the optimization target based on the transient cooling pump air ratio; if so, the target brake disc is the preferred brake disc. Compared with the prior art, this invention solves or partially solves the problem that existing brake disc optimization methods lack constraints during the optimization process, leading to unsatisfactory optimization.

The invention provides an active radiator for a high-power AI server chip, relates to the technical field of radiating devices, and solves the technical problems that in the prior art, the heating power of the chip of an AI server reaches up to 800 W or above, and a traditional radiator cannot meet the requirement for long-term reliable operation of the chip. The device comprises a semiconductor cooler and a 3DVC radiator, the semiconductor cooler is installed on the inner side of the bottom of the 3DVC radiator, and the outer portion of the bottom of the 3DVC radiator is connected with an AI server chip.

The present invention relates to the field of load technology, and specifically to a high-power density rack-mounted load, comprising a box body and a resistor unit arranged in the box body, wherein the resistor unit comprises a plurality of parallel resistor rows, each resistor row comprises a plurality of insulating support plates, a locking assembly and a plurality of spiral resistor bars arranged at intervals, each insulating support plate has a plurality of support holes along its length direction, a plurality of resistor bars pass through the support holes respectively, and each resistor bar relies on its own strength to keep the center line as a straight line; a connecting plate is provided between the plurality of resistor rows, so that the plurality of resistor rows are arranged at intervals; the plurality of resistor bars of each resistor row and the plurality of resistor bars of the plurality of resistor rows are electrically connected to each other. The spiral resistor bar has a large area directly in contact with the air, a fast heat dissipation speed, and a large heat dissipation power per unit volume. The overall load has a small volume and a large power. Compared with a conventional rack-mounted load, the power can be expanded by two to three times under the same volume.

This invention provides an ultra-thin vapor chamber (VC) heat exchanger, comprising a lower VC cover and an upper VC cover disposed on the lower VC cover. The upper VC cover is zigzag-shaped, and several spaced-apart vapor chambers are provided between the upper and lower VC covers. The key feature is the presence of a metal foil capillary structure between the upper and lower VC covers. The lower part of the metal foil capillary structure is attached to the lower VC cover, and the upper part is attached to a portion of the upper VC cover. The metal foil capillary structure includes a metal foil and through-holes and arrayed evaporation reflux holes on the metal foil. A perforated support structure is provided on the metal foil, and the perforated support structure and evaporation reflux holes are alternately arranged. This invention utilizes a metal foil capillary structure, which is thinner than a copper mesh, facilitating the development of ultra-thin VCs. Furthermore, the metal foil capillary structure exhibits better capillary force than traditional copper mesh, enabling the VC to achieve greater heat dissipation power. Simultaneously, the metal foil capillary structure is less expensive than traditional copper mesh.

The present invention discloses a high-light-efficiency light-emitting diode and production equipment, which relates to the technical field of diodes; in order to solve the problem of heat dissipation; the diode specifically includes an aluminum shell, the inner wall of the aluminum shell is clamped with a circuit board, the outer wall of the circuit board is welded with a plurality of light-emitting units, the end face of the aluminum shell is fixed with a lampshade by bolts, the inner walls of both ends of the aluminum shell are provided with heat dissipation holes, and the inner walls of the heat dissipation holes are fixed with hollow frames; the production equipment includes a frame, one side of the frame is connected to a mounting plate for fixing the circuit board, and the top of the aluminum shell is matched with a head through a driving mechanism. The present invention is provided with a heat dissipation fan, a motor, a connecting shaft and other components, the motor can drive the connecting shaft to rotate, thereby driving the heat dissipation fan to rotate, so that a directional airflow is generated in the aluminum shell to dissipate heat, thereby ensuring that the working temperature of the light-emitting unit is suitable, and preventing the light-emitting efficiency from decreasing or overheating and burning due to temperature.