2results about How to "High cooling power" patented technology

This invention relates to a brake disc optimization method, device, and medium based on four-factor constraints. The method includes: obtaining the mass of a target brake disc; establishing a model with an undercarriage structure based on the parameters of the target brake disc, and obtaining the maximum limiting temperature of each part; performing optimization design without exceeding the original mass to obtain the optimized brake disc; performing CFD steady-state simulation to calculate the steady-state cooling pump air ratio; when the maximum temperature is lower than the maximum limiting temperature, determining whether it meets the preset optimization target based on the steady-state cooling pump air ratio; performing CFD transient simulation analysis on candidate brake discs to calculate the transient cooling pump air ratio; when the maximum temperature is lower than the maximum limiting temperature, determining whether it meets the optimization target based on the transient cooling pump air ratio; if so, the target brake disc is the preferred brake disc. Compared with the prior art, this invention solves or partially solves the problem that existing brake disc optimization methods lack constraints during the optimization process, leading to unsatisfactory optimization.

This invention provides an ultra-thin vapor chamber (VC) heat exchanger, comprising a lower VC cover and an upper VC cover disposed on the lower VC cover. The upper VC cover is zigzag-shaped, and several spaced-apart vapor chambers are provided between the upper and lower VC covers. The key feature is the presence of a metal foil capillary structure between the upper and lower VC covers. The lower part of the metal foil capillary structure is attached to the lower VC cover, and the upper part is attached to a portion of the upper VC cover. The metal foil capillary structure includes a metal foil and through-holes and arrayed evaporation reflux holes on the metal foil. A perforated support structure is provided on the metal foil, and the perforated support structure and evaporation reflux holes are alternately arranged. This invention utilizes a metal foil capillary structure, which is thinner than a copper mesh, facilitating the development of ultra-thin VCs. Furthermore, the metal foil capillary structure exhibits better capillary force than traditional copper mesh, enabling the VC to achieve greater heat dissipation power. Simultaneously, the metal foil capillary structure is less expensive than traditional copper mesh.