Heat radiating plate and manufacture method thereof

Abstract

The invention relates to a heat radiating plate and a manufacture method thereof. The heat radiating plate comprises a base (1) and a top cover (2), wherein the base (1) is buckled with the top cover (2); a sealing cavity is formed between the base (1) and the top cover (2); and an injection and exhaust pipe (4) is inserted on the side wall of the top cover (2). The heat radiating plate is characterized in that the sealing cavity is internally provided with a supporting member (3) supported between the base (1) and the top cover (2); and the upper surface of the base (1) and the lower surface of the top cover (2) are respectively provided with a sintering copper powder layer (5). In the invention, because the sealing cavity formed between the base and the top cover is internally provided with the supporting member, the problem that copper materials become soft after high-temperature sintering and silver soldering and the problem that a plate is inwards sunk and deformed due to negative pressure formed by vacuum pumping are solved. The heat radiating plate cannot have the phenomenon that backflow cannot be smoothly carried out due to blocking, thereby greatly improving the heat conductivity, guaranteeing that elements are smooth and have extremely small deformation and ensuring normal works.

Description

(1) Technical field [0001] The invention relates to a heat transfer element, in particular to a plate for rapid heat transfer and heat dissipation of a heating electronic element and a manufacturing method thereof. (2) Background technology [0002] The high-power LED lighting source is composed of light-emitting diode chips, which will quickly generate a lot of heat while emitting light. If the heat cannot be cooled to a lower temperature quickly, it will cause the light-emitting chip to decay at an accelerated rate, which will seriously affect the use of lamps. life. In addition, industries such as computers, communications, and thermoelectric power generation all have situations in which normal work is affected by excessive heat of electronic components. Therefore, solving the heat dissipation problem plays a vital role in the normal operation and service life of electronic products such as high-power LED lighting. As a heat transfer element, the heat sink (note) has be...

AI Technical Summary

Problems solved by technology

[0003] 1. The copper material has the problem of softening after high-temperature sintering and silver brazing, and the negative pressure caused by vacuum exhaust causes the plate to be sunken and deformed. The heat sink is blocked and cannot be reflowed smoothly, which greatly reduces the heat transfer performance.

[0004] 2. Low production efficiency and high production cost affect product promotion

Images