Water cooling plate for heat dissipation of high-power electrical heating element
A technology for heating elements and water-cooling plates, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of unfavorable water-cooled plate heat exchange efficiency, difficulty in reducing fin spacing, and difficulty in increasing fin thickness, etc. The effect of heat dissipation efficiency, increased disturbance, and strong heat dissipation capacity
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[0036] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0037] The new fin arrangement form high-power heat dissipation water-cooled plate, including the upper plate 6 with fins and the lower plate 7 with fins, is a heat dissipation substrate welded together by vacuum brazing, and the surface of the substrate is provided with threaded holes 10 for installing IGBTs , a water pipe joint 5 is also installed, and the threaded hole is inlaid with a wire thread sleeve to meet the torque requirements for installation.
[0038] The upper and lower plate fins are formed by milling grooves on the upper and lower plates. First, the height h of the fins of the upper and lower plates is given 1 , h 2 with spacing. (also both the milling groove depth and groove spacing), when machining the upper plate fin area, the tool feed direction and the upper plate form a certain angle (θ 1 , θ 2 ), the processing is c...
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