High-performance cooler

Abstract

A low-cost, fan assisted cooling device is disclosed. The cooling device 10 includes a narrow bottom 11a and broad top shape 29 to optimize a material versus performance ratio. A plurality of vanes 21 surround a central heat mass 11 and an inside surface 26 of the vanes 21 define a chamber 30 that surrounds the heat mass 11. A portion of each vane 21 is split into a plurality of fins 23 and both the vanes 21 and the fins 23 have a surface area that increase in a radially outward direction r from an axis Z-Z of the heat mass 11. The heat mass 11 includes a boss 13 that is surrounded by a groove 15. Both the boss 13 and the grove 15 have arcuate surface profiles. The vanes 21, the fins 23, the boss 13, and the groove 15 efficiently dissipate heat when a fan 70 or the like forces air F into the chamber 30 thereby producing air flows in three different directions. In a first direction E, the air flows out of the chamber 30 through the vanes 21. In a second direction I, a low pressure region DELTA P in the chamber 30 induces air from outside the chamber 30 to flow through the fins 23. In a third direction B, the low pressure region DELTA P induces an airflow over the groove 15 and boss 13. Openings P between the vanes are angled and offset from an orientation of the fans blades 77 to minimize the airflow shock losses thereby reducing fan noise. The vanes 21 and the fins 23 can be homogeneously formed with the heat mass 11.

Description

technical field [0001] The invention relates to a cooling device for removing heat from a component connected to the cooling device. In particular, the invention relates to a cooling device for removing heat from an electronic device connected to the cooling device. Background technique [0002] It is a well-known technique in the electronics field to provide a heat sink in contact with an electronic device so that waste heat generated by the operation of the electronic device is transferred to the heat sink, thereby cooling the electronic device. With the advent of high clock speed electronic devices such as microprocessors (μP), digital signal processors (DSP), and application-specific integrated circuits (ASICs), the waste heat generated by these electronic devices and the operating temperature of these electronic devices It is directly proportional to the clock pulse speed. Therefore, a higher clock speed increases the generation of waste heat, which in turn leads to a...

AI Technical Summary

Problems solved by technology

[0007] Increasing the size of the fan and heatsink has some disadvantages

First, if the size of the heatsink is increased in the vertical direction (i.e., transverse to the PC board), the heatsink becomes taller and may not fit in a vertical space in many applications (such as a desktop computer). Chassis)

Second, if the PC board has a vertical orientation, a heavy and tall heatsink may mechanically stress the PC board and / or electronics, causing the electronics or PC board to fail

Fourth, if the size of the heat sink is increased in the horizontal direction, the effective area on the PC board for mounting other electronic components will be limited

Fifthly, when radiators have a cylindrical shape formed by fins, it is generally not possible to mount several of these radiators close to each other, since the airflow entering or exiting the fan is blocked by adjacent radiators, thereby reducing the cooling effect

Wider fin stack increases heat sink size, cost and weight

[0012] Third, the reduced fin depth makes the fins more susceptible to bending if damaged

In either case, the result is to disable the fan

Fifth, glue is usually used to fix the fan to the heat sink and the glue may get into the fan and make the fan not work

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