Combined mask, method and equipment for producing organic electroluminescent device using said mask
A manufacturing method and mask technology, which are applied in the direction of identification device, lighting device, semiconductor/solid-state device manufacturing, etc., can solve the problem of no method being provided, and achieve the effect of high productivity
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example 1
[0086] Example 1 will be described below with reference to FIGS. 1 , 2 and 5 . A plate (84 mm wide, 105 mm long, and 25 μm thick) formed of a nickel alloy was prepared as the mask plate 22 for forming the emission layer. In addition, 272 rectangular slits (100 μm wide and 64 mm long) were arranged as deposition slits 32 with a pitch of 300 μm. The rectangular slit is arranged such that its longitudinal direction (in this direction dimension is 64 mm) is along the width direction of the plate (in this direction dimension is 84 mm). In order to prevent the deformation of the slits, in parallel to the width direction of the slits with a pitch of 300 μm, reinforcing lines with a width of 20 μm were formed. Two cross-shaped alignment marks 26 were formed on the board at 5 mm away from the left end line of the board at symmetrical positions with a distance between 30 mm in the width direction of the board. A total of 16 plates were similarly fabricated as masks.
[0087] Each mas...
example 2
[0091] The combined mask obtained in Example 1 was attached to a mask holder in a deposition apparatus for forming a green emitting layer as a combined mask for forming a green emitting layer. Then, another combined mask was fabricated similarly to Example 1, except that the positions of the slits (100 μm wide and 64 mm long) formed in the mask plate were shifted by 100 μm (corresponding to the length of one pitch of ITO electrodes), and used as to form a composite mask for the red emitting layer. In addition, another composite mask was fabricated similarly to Example 1, except that the positions of the slits (100 μm wide and 64 mm long) formed in the mask plate were shifted by 200 μm (corresponding to the length of two pitches of the ITO electrodes), and were used The combined mask used to form the blue emitting layer.
[0092] Next, a 130 nm-thick ITO transparent electrode layer was formed by sputtering on the surface of an alkali-free glass substrate (1.1 mm thick, 436 mm ...
example 3
[0102] As shown in FIG. 3 , a plate (82 mm wide, 103 mm long, and 30 μm thick) formed of a nickel alloy was prepared as a mask plate 122 for forming the emission layer. In addition, 256 rectangular slits (100 μm wide and 62 mm long) were arranged as deposition slits 132 with a pitch of 300 μm. The rectangular slit is arranged such that its longitudinal direction (in this direction dimension is 62 mm) is along the width direction of the plate (in this direction dimension is 82 mm). In order to prevent the deformation of the slits, in parallel to the width direction of the slits with a pitch of 300 μm, reinforcing lines with a width of 20 μm were formed. Two cross-shaped alignment marks 126 were formed on the center line in the longitudinal direction of the board at symmetrical positions with a distance between 68 mm in the width direction of the board. Similarly, a total of 16 reticles were fabricated.
[0103] Each of the mask plates described above was fixed to a frame 124 ...
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