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Device and method for collecting completive test articles for integrated circuit tester table

A technology for testing machines and integrated circuits. It is applied in the direction of charge manipulation, conveyor objects, and object stacking. It can solve the problems of manpower consumption, delay in working hours, waste, etc., and achieve the effect of saving time and avoiding damage to integrated circuits.

Inactive Publication Date: 2003-08-13
MACRONIX INT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The stacking rails used for stacking tubes have a height limit, so operators must repeatedly and frequently take out tubes filled with integrated circuits from the stacking rails so that subsequent tubes can continue to be stacked up, and then place the tubes For the electrostatic box (not shown), this method is more labor-intensive, and obviously cannot meet the requirements of high automation
[0008] In addition, when the tubes are stacked from bottom to top, there may be a phenomenon of tube jamming, which must be stopped to deal with delays in working hours, and even cause the tubes to be squeezed and deformed, and may even damage the integrated circuits loaded in the tubes
[0009] What's more, in order to reduce the probability of failure caused by stuck tubes, the operators often take out the tubes when the tubes are not stacked full, which makes the operators waste a lot of time on the operation of taking the tubes

Method used

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  • Device and method for collecting completive test articles for integrated circuit tester table
  • Device and method for collecting completive test articles for integrated circuit tester table
  • Device and method for collecting completive test articles for integrated circuit tester table

Examples

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Embodiment Construction

[0048] figure 2 It is a schematic diagram of the finished product collecting device of the integrated circuit testing machine of the present invention, which is set in the automatic unloading device.

[0049] Please refer to figure 2 , this finished product automatic discharge device 30 has several finished product discharge ports 32, wherein the completed test product discharge port 32a is used to output the integrated circuit that has passed the test, and the completed test product discharge port 32b is used for output defective integrated circuits. exist figure 2 An empty tube stacking guide rail 34 is installed on one side of the automatic discharge device 30 for the finished test product, and there is a recessed space 36 between the empty tube stacking guide rail 34 and the finished test product discharge port 32a. The finished product collection device 100 of the present invention is installed in the recessed space 36 at an inclination angle relative to the horizon...

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Abstract

An apparatus and method for collecting the passed ICs of IC testers has a long tube to receive the passed ICs from all IC testers, and a switching unit for switching the long tube to the discharge port of each IC tester. Said switching unit has a tube holder to make said long tube inclined and a tube pusher for pushing the tube from its holder.

Description

technical field [0001] The present invention relates to an integrated circuit testing machine (IC handler), and in particular to an unloader apparatus of the integrated circuit testing machine. Background technique [0002] In the process of integrated circuits, any mechanical equipment, process parameters, production process environment and other factors not listed may have a negative impact on the process of integrated circuits, resulting in manufacturing defects. However, for products supplied to consumers, the problem of such manufacturing defects can be minimized through prior quality control. Therefore, before the integrated circuits are used in circuit boards or other components, the integrated circuits must be tested to identify and filter defective integrated circuits. [0003] In order to protect the integrated circuit from external damage, it is necessary to package the integrated circuit. In today's packaging methods, one of the widely used packaging methods is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/74B65G49/07B65G57/32B65G59/06
Inventor 施光华杨伟源陈金福
Owner MACRONIX INT CO LTD