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Heat pipe and mfg. method thereof

A manufacturing method and heat pipe technology, applied in the field of heat pipes for cooling and heat release, and heat conduction

Inactive Publication Date: 2003-08-13
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0038] The present invention is proposed in order to solve the problems of the past micro heat pipes and multiple capillary structures of the above-mentioned single capillary structure

Method used

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  • Heat pipe and mfg. method thereof
  • Heat pipe and mfg. method thereof
  • Heat pipe and mfg. method thereof

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Embodiment Construction

[0059] In order to achieve the above-mentioned purpose, the present invention suggests that the porous sintered powder capillary structure of different substances, shapes or particle sizes is configured in the evaporation part, heat insulation part and condensation part. In order to enhance the porosity and transmittance of the above-mentioned capillary structure, the Powders of different sizes are mixed and sintered, the pores are double-distributed, and the heat pipe has a radially asymmetrical end surface.

[0060] Also, it is highlighted for the correct implementation of the present invention, the optimum conditions for improving the performance inside the capillary, for which the method is documented.

[0061] In order to improve the performance of the sintered powder capillary, the present invention designs and analyzes the relationship between the capillary pressure, transmittance and pore capacity of the porous media and the heat flow of the driving working fluid, and w...

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Abstract

Disclosed is a heat pipe and mfg. method thereof. The a heat pipe comprises: an evaporating section, a heat insulating section, a condensing section and a porous sintered powder wick structure, in which the wick structure comprises sub-structures different from one another in at least one selected from group including material, shape and particle size, each of the sub-structures being arranged into each of the evaporating, heat insulating and condensing sections, in which the wick structure has a biporous distribution made through sintering of a powder mixture having various particle sizes to increase porosity and permeability of the wick structure, and in which the heat pipe has an asymmetric cross sectional shape in a radial direction. Powder having a large particle size is readily inserted into the heat pipe to simplify manufacture of the heat pipe while thermal conductivity of the heat pipe is not degraded compared to a conventional structure which is not eccentric.

Description

field of invention [0001] The invention relates to a heat pipe for heat conduction, cooling and heat release, in particular to an internal structure of a miniature heat pipe and a manufacturing method thereof. Background technique [0002] Generally, a heat pipe is a component used to efficiently conduct heat energy from one place to another, and is used as a core part of a heat transport device. In particular, micro heat pipes are effectively utilized in heat transport and heat dissipation for cooling of high-precision circuits or electronic chips. [0003] figure 1 The end view of the internal structure of the heat pipe shown above. Such as figure 1 As shown, the heat pipe is composed of an outer wall, a channel through which the driving fluid for heat transport passes, and a porous capillary tube between the two for continuously generating heat transport when the driving fluid has no power. [0004] and, if figure 1 As shown, the above-mentioned heat pipe is divided ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/02F28D15/04
CPCF28D15/046F28D15/02
Inventor 吴世民伦纳德·L·瓦西里耶夫
Owner SAMSUNG ELECTRO MECHANICS CO LTD