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Adhesion agent, adhesive membrane and electrie device

一种电气装置、粘接剂的技术，应用在粘合剂加热的粘合方法、胶粘剂、电气元件等方向，能够解决电气装置101导通不良等问题，达到外观形状优良、提高亲和性、导通可靠性高的效果

Inactive Publication Date: 2003-09-03
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] When there are many voids 130 in the adhesive 112, when the electrical device 101 is placed under high temperature conditions for a long time (aging), the semiconductor chip 111 tends to break away from the adhesive 112 on the substrate 113 and float, causing the electrical Device 101 has poor conduction

Method used

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  • Adhesion agent, adhesive membrane and electrie device
  • Adhesion agent, adhesive membrane and electrie device
  • Adhesion agent, adhesive membrane and electrie device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0050] Relative 60 parts by volume are composed of two liquid epoxy resins ("HP4032" manufactured by Dainippon Ink Chemical Industry Co., Ltd. and "EP630" manufactured by Oily Chemicals Co., Ltd.) in an equal amount. Add and mix 40 parts by volume of imidazole-based curing agent (product "HX3921" manufactured by Asahi Kasei Co., Ltd.) and 3 parts by volume of coupling agent (product "A187" manufactured by Japan Unika-Co., Ltd.) "). The mixture of curing agent, coupling agent and adhesive is in paste form. The viscosity of the mixture is 20 Pa·s and the specific gravity is about 1.2.

[0051] When the total capacity of the curing agent and the adhesive is 100 parts by volume, add and mix the types of fillers shown in the "filler" column of Table 1 below at the ratio shown in the "filler" column of Table 1 below , The adhesives of Examples 1-8 and Comparative Examples 1-7 were produced. Each adhesive is in paste form. In addition, the adhesives of Examples 1 to 8 and Comparative Exa...

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Abstract

An object of the present invention is to provide an adhesive with which voids are less likely to occur and adherends are not curved. Adhesives of the present invention have excellent dispensability from nozzles of dispensers because the overall specific gravity of the adhesives is adjusted to 1.4 or more and 4.0 or less by adding a filler having a specific gravity of 3.0 or more and 9.0 or less. A highly reliable electric device 1 can be obtained because no voids are generated in an adhesive 12 or an adherend or a flexible wiring board 5 is not curved when the flexible wiring board and a semiconductor chip 11 are connected.

Description

Technical field [0001] The present invention relates to adhesives, and more particularly to adhesives for connecting semiconductor chips to substrates. technical background [0002] Conventionally, in order to connect semiconductor chips to substrates or flexible circuit boards, paste-like or film-like adhesives have been used. [0003] image 3 The symbol 101 denotes an electrical device in which a semiconductor chip 111 is attached to a flexible circuit board 105 with an adhesive 112. The protruding terminal 121 of the semiconductor chip 111 is in contact with the metal wiring 122 located on the bottom surface of the opening 119 of the cover film 115 of the flexible circuit board 105. [0004] Because the terminal 121 of the semiconductor chip 111 is connected to an internal circuit not shown in the figure, image 3 In the state shown, the internal circuit of the semiconductor chip 111 and the metal wiring 122 of the flexible circuit board 105 are electrically connected through ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J201/00C09J5/06C09J9/02C09J163/00H01L21/56H01L21/60H01L23/29
CPCH01L2224/73203H01L2924/0105H01L2924/01082H01L23/295H01L2924/01004H01L2924/01045H01L2224/16H01L2924/30105H01L2924/01019H01L2224/83192H01L2924/01027H01L2924/01013H01L2924/0107H01L2224/32225H01L21/563H01L2924/01047H01L2224/73204H01L2924/01079H01L24/83H01L2924/01005H01L24/29H01L2924/01033H01L2924/01006H01L2924/01078H01L2224/83856H01L2224/16225H01L2924/12044H01L2924/00H01L2924/00012C09J5/06
Inventor 山本宪
Owner DEXERIALS CORP
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