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Apparatus for installing semiconductor chip

A semiconductor and chip technology, applied in the manufacture of semiconductor/solid-state devices, assembling printed circuits with electrical components, electrical components, etc., can solve problems such as inspection error lag

Inactive Publication Date: 2003-10-15
ESEC TRADING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This type of check has the disadvantage of detecting errors with lag

Method used

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  • Apparatus for installing semiconductor chip
  • Apparatus for installing semiconductor chip
  • Apparatus for installing semiconductor chip

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0029] total maximum M 1 The value of is determined as the value W. This means in Figure 4 middle.

example 2

[0031] Signal U S (t) integral over time is taken as the value W: W = ∫ ta tb Us ( t ) dt - - - - ( 1 )

[0032] Thus, time t a and t b The points at represent the sensitivity range where the substrate 2 enters the sensor 8 and the sensitivity range where it leaves the sensor 8 .

[0033] When the substrate 2 is asymmetrical with respect to its longitudinal axis, then the signal U S The series is not symmetrical. Further analysis of the signal U S , so it can be determined whether the substrate 2 in the loading station 1 exists in the correct orientation. exist Figure 4 In the example, the total maximum value M 1 happens at time t 1 , at time point t 3 The local maximum M of 3 Before. Therefore, to calculate the signal U S , if the lo...

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PUM

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Abstract

An apparatus for mounting semiconductor chips comprises a loading station (1) for the presentation of substrates (2), a first transport system (4) and a second transport system (5). The first transport system (4) removes one substrate (2) after the other from the loading station (1) and passes them on to the second transport system (5) which transports the substrates (2) in steps to a dispensing or soldering station (6) and to a bonding station (7). A sensor (8) with two coils (10, 11) arranged at a distance to one another is arranged in such a way that one end of the substrate (2) transported by the first transport system (4) travels through a gap formed between the two coils (10, 11). The signal delivered by the sensor (8) is used to determine a control signal which indicates whether or not the first transport system (4) should pass the substrate (2) on to the second transport system (5).

Description

technical field [0001] The present invention relates to an apparatus for mounting semiconductor chips. Background technique [0002] For many applications, semiconductor chips are mounted to metal substrates called lead frames. For this purpose, lead frames are removed from them by robotic arms when they are stored in storage containers or stacks and supplied to the conveyor system of automatic assembly equipment called die bonders, which transfers the lead frames one by one. They are transferred one by one to the dispensing station for applying adhesive or solder and the bonding station for mounting semiconductor chips. [0003] When the leadframes are stored stacked, usually when removed, the two leadframes are glued together, thereby replacing a single leadframe, and the two leadframes are removed and conveyed to a conveyor system. In order to detect such errors, the thickness of the lead frame delivered to the conveyor system is measured. This is usually determined me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00
CPCH01L21/67271H01L21/67259Y10T29/41H01L21/52
Inventor 尤金·曼哈特拉特·舒彼格
Owner ESEC TRADING