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Printed circuit board and method for repairing same

A printed circuit board, printed circuit technology, applied in the directions of printed circuit, printed circuit maintenance/correction, printed circuit manufacturing, etc., can solve problems such as spending a lot of time and labor, increasing inspection scope, and not having applicability

Inactive Publication Date: 2003-10-29
CANON KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if the conventional technology (that is, the existing technology) in which all solder mounting parts are inspected is used, the inspection range will be increased, and a lot of time and labor will be required for the inspection process.
In addition, the possibility of missed detection also increases
Moreover, it takes a lot of time and labor to repair the solder on all the solder-mounted parts of the recovered printed circuit boards, so the conventional technology does not have industrial applicability for high-density mounted printed circuit boards

Method used

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  • Printed circuit board and method for repairing same
  • Printed circuit board and method for repairing same
  • Printed circuit board and method for repairing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0039] figure 1 It is a perspective view showing an example of a printed circuit board used in an electronic device using the repair method of the present invention. exist figure 1 Among them, 1 is the printed circuit board. 2 is a printed circuit substrate made of glass epoxy or the like. 3 and 4 are chip resistors mounted on the printed circuit substrate 2 . The chip resistor 4 is a larger electronic component than the chip resistor 3 . 5 is a lead insertion type connector mounted on the printed circuit board 2 .

[0040] figure 2 It is a cross-sectional view showing the solder mounted portion of the chip resistor 3 mounted on the printed circuit board 2 . The chip resistor 3 is surface-mounted on the printed circuit substrate 2 . 3a is a wiring pattern formed on the printed circuit board 2, and 3b is solder. The chip resistor 3 is fixed on the wiring pattern 3a of the printed circuit board 2 by solder 3b, and is electrically connected to the wiring pattern 3a. C...

Embodiment 1

[0054] In Example 1, as a repaired and reused printed circuit board, a figure 1 The printed circuit board 1 shown. First, an electronic device mounted with a printed circuit board 1 was collected from the market. (S1) Next, the electronic device is disassembled. (S2) Separate the disassembled parts and collect the printed circuit board 1 . (S3)

[0055] Here, collection and analysis of the reliability test shown in S8 and the failure data shown in S9 which are performed on a new printed circuit board 1 in advance will be described. In Example 1, a thermal fatigue test was performed as a reliability test. The thermal fatigue test is a test method in which a test product (printed circuit board 1) is placed in a container capable of forming an environment of different temperatures, and thermal stress acts on the test product by repeatedly changing the temperature. In this thermal fatigue test, the test result of the state after accelerated time can be obtained with respect ...

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PUM

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Abstract

A method for restoring a printed circuit board (1) comprises steps: recovering a printed circuit board used in market having plural electronic parts (3,4,and 5) mounted through solders (3b,4b,and 5b) at soldered portions provided on a printed-wiring board (2), assigning soldered portions to be restored according to a failure data derived in a preliminary reliability test of a same printed circuit board, and carrying out a re-soldering at the assigned soldered portion. <IMAGE>

Description

technical field [0001] The present invention relates to the reuse of printed circuit boards used in electronic equipment and the like, and more particularly to a method for repairing printed circuit boards. Background technique [0002] In recent years, recycling electronic devices such as copiers and printers and reusing them has become an important development issue in consideration of environmental issues and the like. Japanese Unexamined Patent Publication No. 10-34122 discloses an invention related to the reuse of image forming apparatuses such as copiers and printers. Japanese Patent Application Laid-Open No. 10-34122 discloses the following content: From quality information such as product failure or parts replacement, and technical information obtained by investigation after recycling and disassembly, the remaining service life of each part recovered is predicted. If it is within the quality guarantee period, it is considered to be reusable. If it is within the qual...

Claims

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Application Information

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IPC IPC(8): H05K3/34H05K3/22
CPCH05K3/225H05K3/3442H05K3/3447H05K2203/176H05K2203/178Y02P70/50
Inventor 池田幸仁永平让二
Owner CANON KK