Method for connecting integrated circuit to substrate and relative circuit wiring
An integrated circuit, connected to the technology, applied in the direction of printed circuit dielectrics, circuits, printed circuits, etc., can solve the problems of poor heat dissipation and poor mechanical stability of integrated circuits
Inactive Publication Date: 2004-07-14
INFINEON TECH AG
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Problems solved by technology
[0014] A disadvantage of this solution is that the heat dissipation of the integrated circuit is much worse when using elastic plastic contact elements than when using solder balls
Another disadvantage is the poor mechanical stability
Method used
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Embodiment Construction
[0038] The diagrams shown in Figures 1a, 1b show a part of a circuit arrangement according to a first embodiment of the invention.
[0039] In Fig. 1a, reference numeral 1a indicates an improved package which is different from Figure 4 The example in is that, on the connection surface AS, the solder balls 30 are only provided on the connection region 150 located within a specific near region IR with respect to the neutral point NP.
[0040]The neutral point NP is a point at which thermal mismatches of the different components have the least influence in the x-direction. In other words, there is no or very little pressure at this point. These pressures will increase with distance from the neutral point. In the near region IR, the pressure is limited to a magnitude that does not cause destructive changes in the expected range of temperature changes. Therefore, the contact area for connection to the circuit substrate 100 is the solder ball 30 located there.
[0041] Conversel...
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Method for assembly of an integrated circuit (5) with a substrate by provision of a packing and substrate with the same number of junction regions, and relieved contact regions on the junction regions. Method for assembly of an integrated circuit (5) ,e.g. a chip, water or hybrid with a substrate by provision of a packing and substrate with the same number of junction regions, and relieved contact regions on the junction regions, forming first and second groups of contact regions, and creation of a connection between the packing and substrate over the relieved regions, where the two groups form rigid and elastic bonds respectively between the packing and substrate. An Independent claim is also included for a switching arrangement providing a connection between the integrated circuit, especially of a chip, wafer or hybrid with a substrate.
Description
technical field [0001] The invention relates to a method of connecting an integrated circuit to a substrate and a corresponding circuit arrangement. Background technique [0002] Although the invention is in principle applicable to any desired integrated circuit, the invention and the problem area on which the invention is based are explained for chips with integrated circuits in silicon technology. [0003] Known chip-scale package (CSP) or wafer-level package (WLP) solutions for attaching integrated circuits to substrates have reliability limitations in the event of temperature variations, especially in the case of large circuit arrangements. problem, especially as the distance between the substrate and the packaged chip continues to decrease. During temperature changes, the different coefficients of thermal expansion of the package's circuit arrangement and the substrate cause different linear expansions of these two components. [0004] In the case of chip-scale packag...
Claims
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IPC IPC(8): H01L21/60H01L23/485H01L23/498H05K3/32H05K3/34
CPCH01L2924/01023H01L2924/01082H05K2201/094H01L2224/4824H01L23/3128H01L24/73H05K3/3436H01L2924/3511H01L2224/81801H01L2224/73215H05K2201/0133H01L2924/01093H01L2924/15311H01L23/49866H05K2201/0314H01L2224/13099H01L23/13H01L2224/48091H01L2224/83102H01L2924/014H01L2224/32225H01L2224/92125H01L24/81H01L23/49816H01L24/48H01L2224/81194H01L2224/81136H01L2224/48227H01L2924/14H01L2924/01005H01L2924/01033H01L2924/01057H05K3/321H01L2924/01077H01L24/10H01L24/13H01L2224/02379H01L2224/05599H01L2224/13H01L2224/45099H01L2224/85399H01L2924/00014H01L2924/181Y02P70/50H01L2924/00H01L2924/00012H01L2224/45015H01L2924/207
Inventor 哈里·黑德勒罗兰德·艾尔西格勒索尔斯坦·迈耶
Owner INFINEON TECH AG