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Surface mounting elemctronic element encapsulation

An electronic component and surface mounting technology, applied in the field of surface mounting electronic component packaging structure

Active Publication Date: 2004-10-27
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the above problem becomes very obvious

Method used

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  • Surface mounting elemctronic element encapsulation
  • Surface mounting elemctronic element encapsulation
  • Surface mounting elemctronic element encapsulation

Examples

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Embodiment Construction

[0020] Preferred embodiments according to the present invention will be described below with reference to the accompanying drawings.

[0021] first preferred embodiment

[0022] figure 1 and figure 2 A piezoelectric acoustic element according to a first preferred embodiment of the present invention, which is a type of surface mount electronic element, is described. The piezoelectric acoustic element generally includes a unimorph piezoelectric diaphragm 1 , a housing 10 and a cover 20 .

[0023] The piezoelectric membrane 1 preferably includes a quadrangular piezoelectric plate 2 and a metal plate 3 , and the metal plate 3 preferably has substantially the same width as the piezoelectric plate 2 and a slightly longer length than the piezoelectric plate 2 . The piezoelectric plate 2 has a top electrode 2a and a rear electrode 2b on its top and rear surfaces, respectively, and is polarized in the thickness direction. The rear electrodes 2b are bonded to the metal plate 3 so a...

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PUM

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Abstract

A package of a surface-mountable electronic component to be reflow-soldered to a circuit board at about 250 DEG C. or more includes a case and a cover. The cover has a softening temperature lower than the reflow temperature, and the case has a softening temperature higher than the reflow temperature. In the package, softening the cover compensates for the stress on the bonded surfaces resulting from a difference in thermal expansion between the case and the cover caused during reflow.

Description

technical field [0001] The invention provides a packaging structure for surface mounted electronic components. Background technique [0002] Piezoelectric acoustic elements are widely used as piezoelectric sounders, piezoelectric receivers, or other elements for generating sound alarms and operating sounds in electronic devices, home appliances, portable phones, and the like. A typical piezoelectric acoustic element includes a diaphragm fixed in a case that is closed with a cover, and one such element is disclosed in Japanese Unexamined Patent Application Publication No. 2000-310990. [0003] At present, the volume of electronic devices is greatly reduced, and it is desired to use a surface mount type piezoelectric acoustic element, which can be directly mounted on a circuit board. For surface mount electronic components, the case and cover of the electronic component must have heat resistance above the reflow temperature. Therefore, the case and the cover are made of heat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/00H04R17/00H05K3/34H05K5/02H05K5/06
CPCH04R17/00H05K2201/10727H05K2201/0129H05K3/3442H05K2203/304Y02P70/50A45B3/04F21V33/0004F21V23/04A45B2200/1018A45B2200/1081
Inventor 上庆一石正光则炭田学
Owner MURATA MFG CO LTD