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Stamping device for generally flat articles

A stamping device and holding device technology, which is applied in the field of stamping devices, can solve problems such as heat loss of the coil drive mechanism, and achieve the effects of eliminating heat input, reducing processing time, and reducing quality

Inactive Publication Date: 2005-02-09
GROZ BECKERT KG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, this tool requires cooling due to heat loss in the coil drive mechanism

Method used

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  • Stamping device for generally flat articles
  • Stamping device for generally flat articles
  • Stamping device for generally flat articles

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] exist figure 1 In , the stamping device 1 is shown as being capable of stamping a substrate. It consists of a cut-off plate held on the frame 3 and forming the lower tool. The cut-off plate 2 serves to support a substrate not further shown and has a complete set of cut-off holes corresponding to the dies 4,5,6,7. Dies 4-7 and others without reference numerals remain in figure 1 On the die holding device 8 shown schematically. This device together with the die forms an upper tool which is guided in a vertical movement on the frame 3 . To stamp the substrate, the die holder 8 is moved vertically, causing the dies 4-7 (at least they are active) to be periodically inserted into their respective cut-off holes. To drive the die holding device, a drive mechanism 9 is used, which is in figure 1 The center is formed by two eccentric drives 11, 12 connected to the die holder 8 via connecting rods.

[0026] For selectively activating or deactivating the die, a control unit 1...

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PUM

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Abstract

A stamping device (1), which in particular is arranged for stamping unfired ceramic substrates, has a die holder device (8) with a plurality of dies (4, 5, 6, 7), which for activation can be locked to the die holder device (8) and then jointly with it execute an axial stamping motion. A coupling device (18) which is remote-actuated is used for the locking. For the remote transmission of the actuation motion, a flexible mechanical connecting means is used, such as preferably a cable (16).

Description

technical field [0001] The invention relates to a stamping device particularly arranged to stamp unfired ceramic substrates or so-called substrates. Background technique [0002] Such substrates are usually provided with a plurality of holes prior to firing; the number and position of the holes (or in other words the pattern of holes) must often vary, or differ from one piece to another. Tools are thus known which have a plurality of movably mounted dies, in which only a selected set of dies is engaged in the punching operation at a time. [0003] For this purpose, a stamping tool with a plurality of dies is known from US Pat. And carry out punching operation. [0004] The installation space required for the coils defines the minimum die distance between adjacent dies. This distance cannot be narrowed arbitrarily. Furthermore, such tools require cooling due to heat losses occurring in the coil drive mechanism. [0005] For different hole patterns in stamped metal sheets...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26F1/02B21D28/00B21D28/24B26D5/08B26D7/00B26F1/04B26F1/40H05K1/03H05K3/00
CPCH05K3/005B26F2210/08B26D5/08H05K1/0306B26F1/04Y10T83/8766Y10T83/8759Y10T83/8831Y10T83/8768B26D7/00B26F1/38B28B11/12
Inventor G·波尔
Owner GROZ BECKERT KG