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Lithographic apparatus, device manufacturing method, and device manufactured thereby

A lithographic projection and beam technology, which is used in semiconductor/solid-state device manufacturing, photolithography process exposure devices, microlithography exposure equipment, etc., and can solve problems such as uneven boundaries

Inactive Publication Date: 2005-02-09
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] It is an object of the present invention to provide a lithographic apparatus according to the preamble, in which the problem of unevenness of the wafer holder at the boundary of the substrate holder is solved and the substrate near the edge of the substrate is made flat in a controllable manner

Method used

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  • Lithographic apparatus, device manufacturing method, and device manufactured thereby
  • Lithographic apparatus, device manufacturing method, and device manufactured thereby
  • Lithographic apparatus, device manufacturing method, and device manufactured thereby

Examples

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Embodiment Construction

[0016] figure 1 A lithographic projection apparatus according to a specific embodiment of the present invention is schematically shown. The unit includes:

[0017] - a radiation system Ex, IL for providing a radiation projection beam PB (for example light in the deep ultraviolet region). In this particular case, the radiation system also includes a radiation source LA;

[0018] - a first target table (mask table) MT provided with a mask holder for holding a mask MA (e.g. a reticle) and with first positioning means for precise positioning of the mask relative to the object PL PM connection;

[0019] - a second target table (substrate table) WT provided with a substrate holder for holding a substrate W (e.g. a resist-coated silicon wafer) and with second positioning means for precise positioning of the substrate relative to the object PL PW connection;

[0020] - A projection system ("lens") PL for imaging the radiation portion of the mask MA onto a target portion C of the ...

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Abstract

A lithographic projection apparatus comprising: a radiation system for providing a projection beam of radiation; a support structure for supporting patterning means, the patterning means serving to pattern the projection beam according to a desired pattern; a substrate holder comprising a plurality of protrusions defining a protrusion configuration for providing a substantially flat plane of support for supporting a substantially flat substrate, the substrate holder comprising at least one clamping electrode for generating an electric field, for clamping a substrate against the substrate holder by said electric field; the substrate holder further comprising a peripheral supporting edge arranged to contact a substrate; and a projection system for projecting the patterned beam onto a target portion of the substrate. According to the invention, the said at least one electrode extends beyond said peripheral supporting edge.

Description

technical field [0001] The invention relates to a lithographic projection apparatus comprising: a radiation system for providing a radiation projection beam; and a substrate holder for supporting a substrate placed in the optical path of said projection beam, the substrate holder comprising a plurality of a protrusion defining a protrusion structure for providing a substantially planar support plane for supporting a substantially planar substrate, the substrate holder comprising at least one clamping electrode for generating an electric field, by The electric field clamps the substrate against the substrate holder; the substrate holder further includes a peripheral support edge configured to contact the substrate. Background technique [0002] Known electrostatic fixtures are usually equipped with components using a backfill gas used to fill the spaces formed between the protrusions, a base plate forming a ground plane supporting the protrusions, and a rear portion of the su...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/027G03F7/20
CPCG03F7/707G03F7/70708G03F7/70783Y10T279/23G03F7/20
Inventor J·J·奥坦斯T·A·R·范埃佩K·J·J·M·扎亚尔
Owner ASML NETHERLANDS BV