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Relay and its manufacturing method

A relay and drive technology, applied in electrical components, electronic switches, pulse technology, etc., can solve the problems of unreasonable structure and high yield of MEMS relays, and achieve the effects of high reliability, stable electrical performance, and increased torsional strength.

Inactive Publication Date: 2005-03-23
PEKING UNIV
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Problems solved by technology

[0006] The present invention overcomes the defects of the unreasonable structure of the above-mentioned MEMS relay, and provides a bulk silicon MEMS relay with simple structure, easy process and high yield

Method used

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  • Relay and its manufacturing method
  • Relay and its manufacturing method
  • Relay and its manufacturing method

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Embodiment Construction

[0064] refer to figure 2 , image 3 , the relay structure of the present invention is generally divided into an upper silicon structure part and a lower glass structure part, and the upper silicon structure part includes: a single crystal silicon structure plate 1 with an anchor point (Anchor) 3 and a beam structure 9, a single crystal silicon structure plate 1 is provided with an upper-level plate driving metal plate 4 and a switch upper-level plate 7, and the beam structure 9 of the monocrystalline silicon structural plate is T-shaped, π-shaped beam or other forms, and adopts a T-shaped, π-shaped beam or groove-shaped beam structure, which can be The vertical stiffness of the beam is directly reduced, and the torsional stiffness of the beam is increased, so that the pull-in voltage of the relay is reduced, and the switching performance of the relay is improved. At the same time, in order to ensure that the devices are structurally connected and electrically isolated, a pol...

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Abstract

The invention provides a body silicon MEMS relay and its preparation method. The relay includes one relay matrix, which adopts the positive direction attracting driving means and is composed of the upper part and the lower part. The upper structure includes the monocrystalline silicon structured board with the anchor points and girder construction. There are the switch upper board and the drive metallic board of the upper board on the monocrystalline silicon structured board. The lower structure includes a glass / silicon substrate structure and on the substrate structure there are the switch lower board and the drive metallic board of the lower board corresponding to the witch upper board and the drive metallic board of the upper board. It has stable electrics performance and high reliability and is hard to puncture it when being driven by the high voltage.

Description

technical field [0001] The invention belongs to the technical field of micro-electro-mechanical systems (MEMS) processing technology, and in particular relates to a bulk silicon MEMS relay and a preparation method thereof. Background technique [0002] As an interdisciplinary emerging technology developed in the 1990s, MEMS technology plays an irreplaceable role in improving people's quality of life and military defense, and has the characteristics of crossover and penetration in certain industries and fields. Due to the characteristics of MEMS itself, in the development process of MEMS, its research fields and processing technologies have the characteristics of various types and diverse technologies. Among the many MEMS processing technologies, silicon-based processing technology has become the mainstream of MEMS processing technology commonly used by MEMS researchers due to its advantages of being compatible with traditional IC technology and various processing methods. A...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03K17/72
Inventor 阮勇张大成郝一龙王阳元王丛舜李婷罗葵田大宇王玮王颖王兆江
Owner PEKING UNIV
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