At least penta-sided-channel type of finfet transistor and manufacture thereof

A fin-type field effect and transistor technology, applied in the direction of transistor, semiconductor/solid-state device manufacturing, semiconductor devices, etc., can solve the problems of damaged fin 702b, uneven width, etc.

Inactive Publication Date: 2005-07-27
SAMSUNG ELECTRONICS CO LTD
View PDF0 Cites 29 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Despite many attempts, the prior art has not developed a technique for removing material from the right corners of tri-gate FinFET 700 (or its dual-gate version) without irreversibly damaging fin 702b. the remainder of the or cause its uneven width

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • At least penta-sided-channel type of finfet transistor and manufacture thereof
  • At least penta-sided-channel type of finfet transistor and manufacture thereof
  • At least penta-sided-channel type of finfet transistor and manufacture thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] During the process of developing the present invention, we recognized the following problems in the background technology and found a path to solve the problems. The background technology thinks that to alleviate the corner effect (again caused by the corners of the substantially square fin-shaped channel) which is difficult to solve in the background technology FinFET (by rounded corner approximation), it can only be done by subtraction, and the corners formed by removing are basically The material realization of the right-angled part. It is now recognized that obtuse angles much greater than 90° significantly reduce corner effects. Such an obtuse angle is similar to a rounded corner, but can be achieved by growing the fin in an additive manner, rather than subtractively, by removing material from the fin having substantially right-angled corners. Epitaxial growth of silicon, for example, enables the desired rounded corner approximation without negatively impacting th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

An at least penta-sided-channel type of FinFET transistor may include: a base; a semiconductor body formed on the base, the body being arranged in a long dimension to have source/drain regions sandwiching a channel region, at least the channel, in cross-section transverse to the long dimension, having at least five planar surfaces above the base; a gate insulator on the channel region of the body; and a gate electrode formed on the gate insulator.

Description

technical field [0001] The invention relates to a channel-type fin field effect transistor with at least five sides and a manufacturing method thereof. Background technique [0002] The need to reduce the size of transistors is a constant problem in integrated circuit technology. One method that the prior art has used to reduce the size of transistors is to reduce the length of the channel. Doing so effectively reduces the overall transistor area. However, after reaching the minimum channel length (relative to other physical parameters of the transistor), it will bring some problems, such as short channel effect. [0003] The state of the art has responded to this by developing transistor architectures that reduce transistor area while maintaining at least a minimum channel length. This solution can be explained by the analogy of the inchworm. Figures 5A-5B A side view of the stages to illustrate the unique locomotion pattern used by the inchworm 602. exist Figure 5A ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/336H01L29/786
CPCH01L29/66795H01L29/7854H01L21/18
Inventor 李化成上野哲嗣柳载润李浩李承换金炫锡朴文汉
Owner SAMSUNG ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products