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Thermal transfer element

一种热转移、元件的技术,应用在电气元件、电固体器件、半导体器件等方向,能够解决产量降低、厚度不规则等问题

Active Publication Date: 2005-08-31
SAMSUNG DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This inkjet method utilizes a relatively simple process, but its yield decreases and / or the thickness of the layer is irregular, and it is difficult to apply this method to a large-sized display device

Method used

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Examples

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no. 1 example

[0026] figure 2 is a cross-sectional view of a laser thermal transfer element for forming an organic thin film layer of an OLED according to a first embodiment of the present invention;

[0027] refer to figure 2 , The laser thermal transfer element according to the first embodiment of the present invention includes a base substrate 200 , a light-to-heat conversion (LTHC) layer 210 , and a transfer layer 220 . The base substrate 200 serves as a supporting substrate for supporting the laser thermal transfer element. The base substrate 200 is made of a transparent polymer such as polyester, polypropylene, polyepoxy, polyethylene, polystyrene, polyethylene terephthalate, etc., and has a thickness of about 10-500Φm. The base substrate 200 may employ a substrate such as a glass substrate or a thin film.

[0028] The LTHC layer 210 absorbs light to convert light into thermal energy, and it has a suitable optical density and includes a light absorbing material. The light-absorb...

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Abstract

A thermal transfer element is capable of improving transfer characteristics because transfer is performed at a low temperature. The thermal transfer element includes: a base substrate as a support substrate; a light-to-heat conversion layer formed on the base substrate to convert incident light to thermal energy; a transfer layer formed on the light-to-heat conversion layer to form an image; and a release layer formed between the base substrate and the light-to-heat conversion layer to facilitate delamination of the light-to-heat conversion layer from the base substrate. The release layer includes a silicon polymer having a glass transition temperature (Tg) of 25 DEG C. or less, and low surface energy. In a further embodiment, the thermal transfer element includes an interlayer formed between the light-to-heat conversion layer and the transfer layer to protect the light-to-heat conversion layer.

Description

technical field [0001] The present invention relates to a heat transfer element, and more particularly, to a heat transfer element capable of improving transfer characteristics by performing heat transfer at a low temperature. [0002] Based on 35 U.S.C § 119, this application claims all benefits arising out of earlier application Serial No. 2004-12397 filed with the Korean Intellectual Property Office on February 24, 2004 and duly assigned, which is hereby incorporated by reference. Background technique [0003] Generally, an organic electroluminescent display device (OLED) includes an anode formed on an insulating substrate as a lower electrode, an organic thin film layer formed on the anode, and a cathode formed on the organic thin film layer as an upper electrode. The organic thin film layer includes at least one of a hole injection layer, a hole transport layer, an emissive layer, a hole blocking layer, an electron transport layer, and an electron injection layer. [0...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/00H01L51/50B41M5/40B41M5/44H05B33/12B41M5/42G12B15/06H05K7/20H05B33/14H05B33/10H01L51/40H05B33/02B32B27/00
CPCB41M2205/06B41M2205/38B41M2205/12H01L51/0013B41M5/42B41M5/443H10K71/18A01G9/021G09F23/00G09F2023/0025
Inventor 金茂显陈炳斗徐旼徹杨南喆李城宅
Owner SAMSUNG DISPLAY CO LTD
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