Radiating module

Abstract

Heat radiation module comprises a first housing, a second housing, a heat conducting structure and several pieces of porous structure. Shape of the first housing is corresponding to shape of the second housing. The second housing possesses an aperture. The heat conducting structure is jointed to the aperture of the second housing. Thus, the first housing, the second housing and the heat conducting structure constitute a closed structure. The said several pieces of porous structure are formed on inner wall of the closed structure.

Description

Cooling module 【Technical field】 The invention discloses a cooling module, especially a cooling module with light weight and high cooling efficiency. 【Background technique】 With the continuous improvement of the performance of electronic devices, cooling devices or cooling systems have become one of the indispensable equipment in current electronic devices, because if the heat energy generated by electronic devices is not dissipated properly, the performance will deteriorate at least, and the serious It will cause burning of the electronic device. Heat sinks are even more important for microelectronic components (such as integrated circuits), because with the increase in integration and the advancement of packaging technology, the area of ​​integrated circuits is constantly shrinking, and the heat energy accumulated per unit area is also relatively low. Therefore, heat dissipation devices with high heat dissipation efficiency have always been actively researched and devel...

AI Technical Summary

Problems solved by technology

However, although the above method makes the heat dissipation module 20 have a lighter weight, there will be a welding layer 28 between the metal base plate 22 and the lower casing 24, and this welding layer 28 will increase the distance between the heat dissipation body 16 and the heat dissipation module 20. Therefore, the cooling efficiency of the cooling module 20 is also reduced

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