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Band extending device

A technology for expanding equipment and holding belts, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc. It can solve the problems that the wafer cannot be divided, the pulling force cannot be fully transmitted, and the problem is not satisfactory, so as to achieve the effect of stable division.

Active Publication Date: 2005-10-12
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the method of extending the holding tape to which the wafer is attached to apply a pulling force to the wafer, there arises a problem that the pulling force cannot be completely transmitted to all regions of the wafer and the wafer cannot be split along all the splitting lines.
Therefore, in terms of reliability, the method is not as good as it should be

Method used

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  • Band extending device
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Embodiment Construction

[0025] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

[0026] In order to split the wafer whose strength decreases along the splitting line, the wafer 10 is placed on the top surface of the elastic holding band 13 mounted on the ring frame 12 by making its upper surface 10a face upward, so that it is supported on the ring frame 12, such as Figure 9 shown. The step of placing the wafer 10 whose strength is reduced along the split line on the top surface of the elastic holding belt 13 mounted on the ring frame 12 will be referred to Figures 10(a) to 10(c) to describe.

[0027] Such as Figure 9 As shown in FIG. 10(a), the wafer 10 in the illustrated embodiment is a semiconductor wafer having a plurality of dividing lines 101 formed in a grid pattern on the front surface 10a and divided by the plurality of dividing lines 101 on it. Circuitry 102 is formed in each of the plurality of regions. As sh...

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PUM

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Abstract

A tape expansion apparatus for expanding a holding tape, which is mounted on an annular frame and to which a wafer having a plurality of areas sectioned by a plurality of dividing lines is affixed, comprising a frame holding means for holding the annular frame; a plurality of tape holding means for nipping an area between the inner periphery of the annular frame and the wafer of the holding tape mounted on the annular frame held on the frame holding means; and a tape expansion means for moving the plurality of tape holding means in radial directions.

Description

technical field [0001] The present invention relates to a tape expanding device for expanding a holding tape, which is fixed on an annular frame and to which a wafer having a plurality of regions divided by a plurality of dividing lines is adhered. Background technique [0002] In the production process of semiconductor devices, multiple regions are divided by dividing lines called "streets" arranged in a grid pattern on the front surface of a generally disk-shaped semiconductor wafer, and each Circuits, such as ICs, LSIs, etc., are formed in each divided area. Individual semiconductor chips are formed by dicing the semiconductor wafer along dicing lines to divide it into regions having circuits formed thereon. Optical device wafers including gallium nitride-based compound semiconductors laminated on sapphire substrates are also diced along dicing lines to separate into individual optical devices, such as light emitting diodes or laser diodes, which are widely used in elect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/301H01L21/00H01L21/304H01L21/78
CPCH01L21/67132
Inventor 永井祐介大宫直树饭塚健太吕
Owner DISCO CORP