Laser beam processing machine

A laser beam and processing machine technology, applied in metal processing, laser welding equipment, metal processing equipment, etc., can solve problems such as unsatisfactory productivity and achieve the effect of high-efficiency laser beam processing

A laser beam and processing machine technology, applied in metal processing, laser welding equipment, metal processing equipment, etc., can solve problems such as unsatisfactory productivity and achieve the effect of high-efficiency laser beam processing

CN1683107AInactive Publication Date: 2005-10-19DISCO CORP
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  • Laser beam processing machine
  • Laser beam processing machine
  • Laser beam processing machine

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Embodiment Construction

[0026] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0027] Figure 1 is a perspective view of a laser beam processing machine constructed in accordance with the present invention. The laser beam processing machine shown in Fig. 1 comprises a stationary base 2, a chuck table mechanism 3 for holding a plate-shaped workpiece, a laser beam applying unit supporting mechanism 4, and a laser beam applying unit 5, wherein the chuck table mechanism 3 is Mounted on the stationary base 2 in a manner that can move along the processing feed direction indicated by the arrow X, the laser beam applying unit support mechanism 4 can be moved along the direction indicated by the arrow Y in the direction perpendicular to the direction indicated by the arrow X. It is installed on the stationary base 2 in a manner of moving in the direction of 100°, and the laser beam applying unit 5 is installed on the support mechan...

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Abstract

A laser beam processing machine comprising a chuck table having a workpiece holding surface for holding a plate-like workpiece, a laser beam application means having a condenser for applying a laser beam from the top surface side of the workpiece held on the chuck table to form a focusing point, and a focusing point position adjusting means for moving the focusing point formed by the condenser in a direction perpendicular to the workpiece holding surface, wherein the machine further comprises a height position detection means for detecting the height position of an area to which a laser beam is applied from the condenser of the top surface of the workpiece held on the chuck table, and a control means for controlling the focusing point position adjusting means based on the height position detection signal of the height position detection means.

Description

technical field [0001] The present invention relates to a laser beam processing machine for performing laser processing along a predetermined processing line on a plate-like workpiece held on a chuck table. Background technique [0002] In the production process of a semiconductor device, a plurality of regions are divided according to dividing lines called "streets" arranged in a lattice pattern provided on the front surface of a substantially disk-shaped semiconductor wafer, and in each divided region, such as IC , LSI and other circuits. Individual semiconductor chips are manufactured by dicing the semiconductor wafer along boundary lines to divide it into regions on which circuits are formed. Also, wafers containing optical devices such as gallium nitride-based compound semiconductors laminated on the front surface of a sapphire substrate are diced along the dividing line to separate individual optical devices such as light-emitting diodes or laser diodes widely used in...

Claims

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Application Information

Patent Timeline
19 Oct 2005
Publication
CN1683107A
IPC
B23K26/03; B23K26/10; B23K26/40; H01L21/301; H01L21/304
CPC
B23K26/4075; B23K2201/40; B23K26/034; B23K26/0853; B23K26/03; B23K26/032; B23K26/048; B23K26/0884
Inventors
能丸圭司