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Densified heat transfer tube bundle

A heat exchanger and tube technology, applied in the field of heat exchange tube bundles, can solve the problem that the density is not controllable uniform or accurate, and achieve the effect of reducing the pressure drop

Active Publication Date: 2010-11-10
BALTIMORE AIRCOIL CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this increased density is not controllable uniform or precise

Method used

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  • Densified heat transfer tube bundle
  • Densified heat transfer tube bundle
  • Densified heat transfer tube bundle

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Embodiment Construction

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Abstract

The purpose of the invention is to increases heat transfer surface area for a given heat exchanger size by increasing the packing density of circuits in a heat exchanger coil assembly. This allows the number of circuits in the coil assembly of a heat exchanger to be increased. The coil assembly is made up of arrays of substantially equally spaced apart serpentine circuits located in the coil assembly region of the conduit, with adjacent circuits being arranged in a parallel offset fashion in which adjacent return bends are overlapping. The tubes have an effective diameter of D. Depression areas are provided at the points of overlap to locally reduce the diameter at the overlap. This provides a circuit-to-circuit with a density D / S >1.0, preferably greater than 1.02, where S is the spacingbetween adjacent circuits and D is the effective diameter of the tubes. The depression areas provide only a minimal increase in internal fluid pressure drop but result in increased heat transfer surface area since additional circuits can be added in a given size constraint application. The inventive coil assembly is useful with various types of heat exchangers.

Description

Densified Heat Exchanger Tube Bundle technical field The present invention relates to a heat exchange tube bundle having a uniform densified structure. More particularly, the invention relates to a tube bundle and method of manufacture in which dimples are provided at least at the overlapping areas of the return bends so that the resulting overlapping tubes can be assembled with an increased density, wherein, The loop-to-loop spacing between adjacent tubes is smaller than the projected cross-sectional area of ​​each tube. Background technique Various heat transfer tube bundle systems are known. Typical condenser and closed loop cooling towers consist of many lengths of tube bundles joined in an array. The tubes may be formed in a serpentine form or in a series of discrete tubes penetrating the header section. The pipe contains a condensing evaporator or medium to be cooled; such as water. In the finished product, air and / or water are forced to flow over the entire oute...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28F1/00F28D5/02F28D7/08F28F1/10F28D1/047F28B1/06F28F13/08F28C1/02
CPCF28D1/0477F28B1/06F28D7/087F28D5/02F28D7/08F28D7/10
Inventor D·阿伦T·P·卡特F·T·莫里森
Owner BALTIMORE AIRCOIL CO INC