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Wire layout structure of light sensitive chip, and semiconductor substrate of light sensitive chip

A photosensitive chip and circuit layout technology, which is applied to the coupling of semiconductor devices, optical waveguides, circuits, etc., can solve the problems of reduced capacitance value of photosensitive diode 21, noise interference, etc.

Inactive Publication Date: 2005-11-16
SUNPLUS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While the pixel size is continuously reduced, the capacitance value of the photosensitive diode 21 will also be continuously reduced, so that it is more susceptible to noise interference

Method used

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  • Wire layout structure of light sensitive chip, and semiconductor substrate of light sensitive chip
  • Wire layout structure of light sensitive chip, and semiconductor substrate of light sensitive chip
  • Wire layout structure of light sensitive chip, and semiconductor substrate of light sensitive chip

Examples

Experimental program
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Effect test

no. 1 example

[0057] The circuit diagram of the photosensitive unit of the present invention is as figure 1 As shown, please refer to the foregoing description, and details will not be repeated here. The main feature of the present invention is to change the circuit layout structure of the photosensitive chip, so as to block free electrons from scurrying around to the N-type doped regions in other adjacent photosensitive regions, such as Figure 6 to Figure 9 shown.

[0058] Figure 6 A schematic top view showing an N-type doped region doped on a P-type substrate of a photosensitive unit according to a preferred embodiment of the present invention, Figure 7 A schematic top view of an N-type doped region doped on a P-type substrate and a polysilicon circuit layer of a photosensitive unit according to a preferred embodiment of the present invention is shown. Figure 8 A schematic top view of an N-type doped region doped on a P-type substrate and one of the metal circuit layers of a photos...

no. 2 example

[0067] However, the application of the present invention is not limited thereto. In addition to the metal line 272 that can shield the source of the transistor as described above, the metal line 272 can also shield the drain of the transistor, as Figure 10 As shown, it shows a schematic top view of the N-type doped region doped on the P-type substrate and one of the metal circuit layers of the photosensitive unit according to another preferred embodiment of the present invention. Other parts marked the same as those in the above-mentioned embodiments are as described above, and will not be repeated here.

[0068] in conclusion

[0069] To sum up, in the circuit layout structure of the photosensitive chip of the present invention, an N-type doped region is arranged between the photosensitive regions of adjacent photosensitive units. After the light is irradiated on the photosensitive region, free electrons will be generated. Since the free electrons will be absorbed by the ...

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Abstract

The layout structure includes a semiconductor substrate, multiple first wires and multiple second wires. There are multiple sensing units in matrix mode arranged on semiconductor substrate. Each sensing unit possesses a first blocking area, a second blocking area and a light sensing area arranged on surface of the semiconductor substrate. The first blocking area is positioned between light sensing areas adjacent up and down to each other; and the second blocking area is positioned between light sensing areas adjacent left and right to each other in order to block free generated electrons struck by light wallop anywhere.

Description

technical field [0001] The invention relates to a circuit layout structure of a photosensitive chip and a semiconductor substrate of the photosensitive chip, in particular to a circuit layout structure of a photosensitive chip and a semiconductor substrate of the photosensitive chip that can reduce mutual interference of signals. Background technique [0002] In today's era of information explosion, information can be transmitted far and wide through electronic information, and it is also very convenient for users to carry these electronic materials. As far as the video capture device is concerned, the video data is generally captured by a photosensitive chip, and then the analog video data is converted into a digital video signal by an analog / digital converter, and then the digital video signal can be processed. storage, transmission or further video processing. Generally speaking, a video sensor has multiple photosensitive units, and the photosensitive units can change th...

Claims

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Application Information

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IPC IPC(8): H01L27/14
Inventor 丹尼尔・凡・布勒克姆杨孟璋
Owner SUNPLUS TECH CO LTD