Production method for improving electromagnetic performance and bottom layer quality of copper containing orientation silicium steel
A technology of oriented silicon steel and production methods, applied in heat treatment equipment, heat treatment process control, manufacturing tools, etc., can solve the problems of improving the quality of the bottom layer, unstable magnetic properties and bottom quality, and difficult to improve the quality of the bottom layer of finished products, and achieve simple operation and excellent quality. The quality of the bottom layer and the effect of improving the magnetism
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment Construction
[0030] The components and weight percentages are: 0.034%C, 3.10%Si, 0.20%Mn, 0.0040%S, 0.015%Als, 0.0086%N, 0.49%Cu, the rest is Fe and unavoidable impurities, hot rolled to a thickness of 2.50mm Oriented silicon steel slabs, after the first cold rolling to 0.63mm, in the wet nitrogen-hydrogen atmosphere of the temperature and partial pressure ratio (all see the list) set in the present invention, implement intermediate annealing, the carbon in the steel plate Remove to less than 30ppm; second cold rolling to finished product thickness 0.27mm; implement low-temperature recovery annealing in a nitrogen-hydrogen atmosphere with set temperature and different partial pressure ratios (see table for both); coating with MgO as the main component Annealing release agent; annealing at a temperature lower than 1200°C after coiling; stretching and leveling annealing after uncoiling, and coating of insulating coating at the same time. The magnetic properties and coating properties of the f...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap