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Radiation apparatus

A heat dissipation device and plate technology, which is applied to the cooling of instruments, parts of instruments, instruments, etc., can solve the problems of excessively increasing manufacturing costs, time-consuming and troublesome processing, etc.

Inactive Publication Date: 2006-06-14
HWA-TEK MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing heat dissipation device is shown in Figure 6, the heat dissipation device 1 is composed of a plurality of metal plate parts 2, a number of lugs 3 are provided on the opposite sides of the plate part 2, and corresponding perforations are provided on the plate part 2 4. For the protruding piece 3 of the adjacent plate 2 to pass through. The protruding piece 3 has a body 5 and two arms 6 extending obliquely from the body 5. When assembling each plate 2, the protruding piece 3 needs to be 3 is inserted into the perforation 4 of the adjacent plate 2, and then the two obliquely extended arms 6 are flattened so that the lug 3 is clamped in the perforation 4 to combine the plates 2 together. Although this structure is stable , but the processing is too time-consuming and labor-intensive, which will increase the manufacturing cost

Method used

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  • Radiation apparatus
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Embodiment Construction

[0011] see figure 1 , figure 2 , the heat dissipation device 10 provided by the first preferred embodiment of the present invention is composed of a plurality of plates 20, wherein the plate 20 has a rectangular sheet-shaped body 22, and a first side wall 30 is composed of the body 22 One side extends out and is perpendicular to the body 22, and a second side wall 40 extends from the other side of the body 22 and is perpendicular to the body 22. The plate 20 is made of heat-conducting materials such as copper and aluminum. made by.

[0012] The first side wall 30 is provided with two clips 32 and two through holes 35, the clips 32 extend downward from the first side wall 30, the clips 32 are approximately semicircular, the clips The connecting piece 32 has a rectangular embedding hole 33, and the two sides of the locking piece 32 are respectively provided with a concave portion 34. The through hole 35 is U-shaped and adjacent to the body 22, so that a rectangular convex is ...

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PUM

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Abstract

The invention is a radiator, comprising plural plate components, where each plate component has a main body, a first side wall extending out from one side of the main body and a second side wall extending out from the other side of the main body, where the first side wall is provided with a fastening plate and a through hole, the fastening plate has an embedding hole, the through hole is U-shaped and adjacent to the main body to form a raised part in the center, the through hole is held by the fastening plate of the other plate component, the raised part is fastened in the embedding hole of the other plate component, thus combining plural plate components together; and the radiator is easy to assemble and firmly structured.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device which is easy to assemble and has a stable structure. Background technique [0002] The existing heat dissipation device is shown in Figure 6, the heat dissipation device 1 is composed of a plurality of metal plate parts 2, a number of lugs 3 are provided on the opposite sides of the plate part 2, and corresponding perforations are provided on the plate part 2 4. For the protruding piece 3 of the adjacent plate 2 to pass through. The protruding piece 3 has a body 5 and two arms 6 extending obliquely from the body 5. When assembling each plate 2, the protruding piece 3 needs to be 3 is inserted into the perforation 4 of the adjacent plate 2, and then the two obliquely extended arms 6 are flattened so that the lug 3 is clamped in the perforation 4 to combine the plates 2 together. Although this structure is stable , but the processing is too time-consuming and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G12B15/06
Inventor 周业勋
Owner HWA-TEK MATERIAL CO LTD