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Airflow control system

A technology of airflow control and airflow, applied in cooling/ventilation/heating renovation, instrumentation, calculation, etc., can solve the problem of uneven airflow

Inactive Publication Date: 2006-06-14
INTEL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although such forced convection cooling systems can provide more efficient cooling than natural convection cooling systems, the airflow in the enclosure or case of a computer or electronic system is generally not uniform

Method used

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  • Airflow control system
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Examples

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Embodiment Construction

[0015] see figure 1 , a chassis 102 for a computer or other electronic device is schematically shown. As shown, chassis 102 may include one or more circuit boards 107 disposed within chassis 102 . According to one embodiment, chassis 102 may be an Advanced Telecommunications Computing Architecture (Advanced TCA or ATCA) chassis, compliant with the Advanced Telecommunications Computing Architecture (ATCA) Amendment published on December 30, 2002 by the PCI Industrial Computer Manufacturers Group (PICMG). Version 3.0, or compatible with it. According to such an embodiment, the circuit board 107 disposed in the chassis may be an ATCA board, and may also be called an ATCA blade. In some embodiments, one or more circuit boards 107 may be configured to couple with one or more cards 109 , 111 . Cards 109 , 111 may be removably and / or permanently coupled to circuit board 107 .

[0016] The chassis 102 may include an air cooling system including, for example, an air inlet area 101 ...

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PUM

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Abstract

A method according to one embodiment may include providing a flow blocking assembly comprising at least one airflow control zone having airflow resistance. The method of this embodiment may also include placing the baffle assembly in the flow of air through the chassis. Of course, many alternatives, changes and modifications are possible without departing from this embodiment.

Description

technical field [0001] The present disclosure relates to airflow control systems, apparatus, and methods for computers and electronic equipment. Background technique [0002] Increases in processor speed and circuit board density have resulted in an increase in the amount of heat generated by computer systems and other electronic systems. In conventional computer or electronic systems, heat generated by the various components of the system is often removed by convective cooling of the various components (or co-packaged components). Convective cooling of a computer or electronic system may utilize the natural convection current caused by heat generated by various heat generating elements to circulate air within the computer or electronic system's housing or case. However, natural convection cooling is often relatively inefficient and can even be insufficient, especially for systems that generate large amounts of heat and / or are susceptible to damage from overheating. [000...

Claims

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Application Information

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IPC IPC(8): H05K7/20G06F1/20
CPCG06F1/20
Inventor 克里斯托弗·卢塞罗贾维尔·莱加詹姆斯·希普利克里斯托弗·冈萨雷斯
Owner INTEL CORP