Apparatus and method for single die backside probing of semiconductor devices

Abstract

An apparatus for facilitating single-die backside probing of semiconductor devices, comprising a die holder configured to receive a single integrated circuit die mounted thereon, said die holder being held in an X - It is movably engaged with the lifting plate in the Y direction. A lift ring is coupled to the lift plate, the lift ring being configured to facilitate adjustment of the lift plate and the die holder in the Z direction.

Description

technical field [0001] The present invention relates generally to semiconductor device fabrication, and more particularly to apparatus and methods for single die backside probing of semiconductor devices. Background technique [0002] In the manufacture of semiconductor devices, it has been found that the ability to obtain waveform measurements from internal nodes is an indispensable aspect for failure analysis and assessment. Often, the active area of ​​a semiconductor device is obscured by limitations of I / O (input / output) circuits, interconnect lines, packaging, or probing devices. During the development phase of an integrated circuit, early engineering hardware is often qualified by imposing various test conditions on the device such as speed, stability, and other parameters. The performance of these devices is measured and diagnosed by obtaining waveforms from key circuit nodes within the device such as clock signals, enable signals, address bus, and data bus. However...

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Thus, switching from one type of detection to another requires factory-trained personnel to reset the tool after switching to a different detection operation

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