Method for manufacturing multi-layer combined macromolecular PTC chip

A multi-layer composite and high molecular polymer technology, which is applied in the field of high molecular PTC thermistor chip structure and its manufacturing, can solve the problems of component burning, achieve long-term performance improvement, reduce the possibility of burning, and reduce resistance drift Effect

Inactive Publication Date: 2010-10-13
SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But the recovered resistance will be slightly higher than the initial resistance
And when the voltage or current that the PTC bears exceeds its limit, the element may burn

Method used

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  • Method for manufacturing multi-layer combined macromolecular PTC chip
  • Method for manufacturing multi-layer combined macromolecular PTC chip
  • Method for manufacturing multi-layer combined macromolecular PTC chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Such as figure 1 As shown in the schematic diagram of the multilayer composite structure of the polymer PTC chip, the polymer PTC material layer is two layers, and a copper sheet layer 5 is added between the two layers of polymer PTC material layers 3 and 4, and the upper and lower layers of the polymer PTC material layer Electrode sheets 1 and 2 are compounded on the surface layer.

[0020] The manufacturing method of this structure is: mix high-density polyethylene, carbon black, nano-calcium carbonate, magnesium hydroxide and antioxidant in a high-speed mixer for 10 minutes in a certain proportion. Then mix each component of the mixture in an internal mixer at a temperature of 180°C, and after cooling and crushing, put it in a compression mold with a pressure of 5 MPa and a temperature of 180°C to form an area of ​​200 cm 2 , 0.8mm thick core material.

[0021] Electrodeposition is used on both sides of a copper foil to make a special copper sheet by co-depositing...

Embodiment 2

[0025] Such as figure 2 As shown in the schematic diagram of the multilayer composite structure of the polymer PTC chip of embodiment 2, the polymer PTC material layer is three layers, and two copper sheet layers 5,7 are added between the three layers of polymer PTC material layers 3,4,6, That is, a copper sheet layer is added between every two layers of polymer PTC material layers, and electrode sheets 1 and 2 are compounded on the upper and lower surfaces of the polymer PTC material layers.

[0026] Polyethylene, polyvinylidene fluoride, graphite, metal powder, talcum powder, antioxidant, coupling agent are mixed, and its manufacture method is identical with embodiment 1.

[0027] The manufactured polymer PTC thermistor can have small resistance drift after recovery, high long-term performance stability, and at the same time, greatly reduce the possibility of burning.

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Abstract

The invention relates to a method for multilayer compounded producing high polymer PTC chip, providing a electric device whose main material is conductive high polymer composite material and relative producing method, and especially relating to a chip structure of high polymer PTC thermal resistor and relative producing method. Said high polymer PTC chip multilayer composite structure comprises ahigh polymer PTC material layer and the electrodes compounded outside the material layer. Wherein, said high polymer PTC material layer comprises at least two layers and a copper sheet layer can be added between the high polymer PTC material layers. The inventive high polymer PTC thermal resistor chip can effectively reduce the recovered resistance shift to improve the service life of product, aswell as the copper sheet layer can be used as separation layer to make the element break along the copper separation layer when it is invalid to reduce the burning possibility.

Description

Technical field [0001] The polymer PTC chip multi-layer composite manufacturing method of the present invention relates to a kind of electronic components and its manufacturing method with conductive polymer composite material as the main raw material, especially a kind of polymer PTC thermistor chip structure and its manufacturing method. Background technique [0002] The positive temperature coefficient PTC (positive temperature coefficient) phenomenon can be exhibited in the crystalline or semi-crystalline polymer composite material filled with conductive particles. That is to say, within a certain temperature range, its own resistivity will increase with the increase of temperature. These crystalline or semicrystalline polymers include polyethylene, polypropylene, polyvinylidene fluoride, polychlorotrifluoroethylene, and copolymers thereof. Conductive particles include carbon black, graphite, carbon fiber, metal powder (such as silver powder, copper powder, aluminum po...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/00B32B27/18B32B15/08B32B37/14
Inventor 吴国臣侯李明王军连铁军刘锋
Owner SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO LTD
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