Marker method for optical polishing process

Abstract

The invention discloses a marking method of optical manufacturing polish, which is characterized by the following: adapting interferometer of corrugated interference measuring method to receive the interference stripe through photoconducting device; gaining the elevating position distribution of detected workpiece surface through computer; generating false color picture; marking the manufacturing or non-manufacturing position for false color picture and real-time interference stripe. The invention avoids the location error of image difference, which is fit for high-precise optical element manufacturing.

Description

technical field [0001] The invention relates to the field of polishing technology, in particular to a marking method for real-time indicating or measuring the feeding movement position of a polishing head or a workpiece. Background technique [0002] In the polishing of optical processing, it is often necessary to repair and polish the processed surface according to the measurement results, especially when processing aspheric optical surfaces, the occurrence of errors is unavoidable, and repeated polishing is required to complete. In this process, it is a very cumbersome work to correct the marking of the position. [0003] In the prior art, the measurement of the surface of the processed part can be carried out by using the wave surface measurement method of the interferometer. When the measured surface fluctuates, the resulting interference fringes will bend and deform in different directions. On the one hand, it can be visually observed Judging th...

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Problems solved by technology

[0005] With the above method, the accuracy of real-time positioning can be improved, but it has the following defects: (1) various optical elements (such as lenses, etc.) actually used have certain aberrations, and in this method, the figure of the processed element is formed by There are different deformations between the interferogram obtained by the CCD camera and the interferometer obtained by the interferometer, so it is difficult to achieve accurate superposition between the corresponding positions of the two, and processing errors will occur; (2) Since the CCD camera is used to provide real-time images, In order to reflect the position of the small grinding head, the interferometric measurement cannot be performed at the same time. Therefore, the result of the interferometric measurement is the result of a certain period of time before. During the processing, it cannot reflect the situation of repairing and polishing in real time, which may cause repeated Carry out problems such as repairing and throwing, and the degree of repairing and throwing cannot be reflected at the same time; (3) The use of CCD camera and image acquisition card increases the cost of equipment

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