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Multilayer soft printed wiring board and production method thereof

A printed circuit board and cable technology, applied in the direction of multi-layer circuit manufacturing, printed circuit, printed circuit components, etc., can solve the problems of poor insulation of cables, limited wiring density, broken wires, etc., to eliminate the problems of poor insulation or broken wires. Effect

Active Publication Date: 2011-09-07
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the method of providing the rigidity suppressing part, there is a disadvantage that the cutout of the cable itself, the cutout of the cover layer, and the regulation of the pattern width are limited by the wiring density.
[0009] In addition, the method of making one of the cables with a two-piece structure longer (refer to Japanese Patent Laid-Open No. 2003-133733 ) is also effective, but due to the complicated bending inside the hinge structure, the flexure will move, and the gap between the cables will still be affected. There are occasional failures such as poor insulation or disconnection due to friction

Method used

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  • Multilayer soft printed wiring board and production method thereof
  • Multilayer soft printed wiring board and production method thereof
  • Multilayer soft printed wiring board and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] figure 1 represents embodiment 1 of the present invention, figure 1 (a) is a plan view, figure 1 (b) is a side sectional view. In the present embodiment 1, the cable 200 with two overlapping structures is used to connect the component mounting parts 101 and 102 as a printed circuit board, and the component mounting parts 101 and 102 are composed of two layers of single-sided materials 1 that are bonded by lamination. Adhesive or prepreg (hereinafter both collectively referred to as lamination adhesive) 2 and outer layer material 3 laminated 4-layer circuit board.

[0053] At the stage before the printed circuit boards are laminated, the double-sided tape 4 is pasted in advance on one of the faces of the two cables facing each other at the position between the hinged portion and the component mounting portion of the cable 200 . At this time, the unsealing film on the side opposite to the adhesive surface of the double-sided tape 4 remains.

[0054] After carrying ...

Embodiment 2

[0057] image 3 Showing the second embodiment of the present invention, the cable connecting the component mounting parts has a three-piece structure. image 3 (a) is a floor plan, image 3 (b) is a side sectional view. Make flexures from large to small in the order of the inner cable and the central cable, and fix the three cables to each other with double-sided tape 4 at position B. image 3 (c) shows this state. As in this example, when the cable is helically wound around the hinged portion, the inner portion of the cable is fixed with a larger flexure, so that the number of thin circuit boards constituting the cable can be set arbitrarily.

Embodiment 3

[0059] Figure 4 Example 3 of the present invention is shown. Such as Figure 4 As shown in (b), when the cable 11 is wound in a coil at the hinged portion, the planar shape of the cable portion usually becomes as follows: Figure 4 (a) shows the crank shape. In addition, the portion where the cable 200 forms a flexure facing the connecting portion of the component mounting portion 101 , 102 is drawn out in a direction perpendicular to it.

[0060] Such as figure 1 In the case of the illustrated embodiment 1, it is sufficient to fix the flexure at the position between the hinge bend portion and the component mounting portion, but in Figure 4 In the case of (a), it is necessary to fix the flexure within the hinge bend. At this time if Figure 4 As shown in (c), two fixed parts 41 and 42 are set with double-sided adhesive tape, and the flexure part is fixed between the two solid parts.

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PUM

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Abstract

The present invention provides a printed board in which a drawback such as insulation failure or disconnection will not occur, due to the result that the inner cable is restricted by an outer cable from being bent complicatedly, when a printed board, having a cable of a structure in which a plurality of single-sided flexible substrates are laminated, is used as a portion to be bent by a hinge andgeneration of friction between the cables occurs, and to provide a manufacturing method thereof. The printed board has a plurality of component mounting units 101, 102, and a cable unit for connecting between the component mounting units, wherein the cable unit consists of a single-sided flexible board and includes two or more cables to be hinge-bent. This printed board is provided with a fixing means for both cables for fixing a portion that will not be bent of the cable as an inner part in hinge-bending to the cable as an outer part, in a state where the portion is curved by the length of deflection, when the cable is hinge-bent. The manufacturing method thereof is also provided.

Description

technical field [0001] The present invention relates to a printed circuit board used in electronic equipment and a manufacturing method thereof, and more particularly to a multilayer flexible printed circuit board provided with a cable portion composed of a plurality of cables connected to a component mounting portion and a manufacturing method thereof. Background technique [0002] Printed circuit boards are mounted on equipment after mounting electronic components. However, in order to realize the miniaturization of equipment, it is often necessary to mount three-dimensional components, so it is necessary to bend the printed circuit board. [0003] Therefore, there is provided a multilayer flexible printed circuit board having a component mounting portion (a portion requiring thickness) and a flexible portion (cable portion) in combination. By using such a circuit board, after component mounting, the flexible part is bent and three-dimensionally arranged, so that space can...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K1/02H05K1/00H05K1/14
Inventor 长谷川裕子畔柳邦彥
Owner NIPPON MEKTRON LTD