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Punched hole processing method of flexible printed circuit lining

A technology of a flexible printed circuit and a processing method, which is applied in the field of punching processing, can solve the problems of drop in suction pressure, poor operation efficiency, and difficulty in realization, and achieves the effect of improving operation efficiency and eliminating unfavorable situations.

Inactive Publication Date: 2006-08-16
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Thus, there is a problem that when installing a new flexible printed circuit substrate 14, it must be confirmed each time that there is no blanking waste 15 on the surface of the bottom mold 12, and when there is a blanking waste 15, it must be checked by blowing. After the blanking waste 15 is removed by air and brush, the next flexible printed circuit substrate 14 is installed, and the work efficiency is poor
[0012] It is also considered that the bottom of the bottom mold 12 has a sealed structure in such a way that the blanking waste 15 does not bulge on the surface of the bottom mold 12, and the method of discharging the blanking waste 15 by air suction is also considered. However, when there are multiple pairs of flexible printed circuits When the part where the substrate 14 is punched is sucked by the same system, there is a disadvantage that the suction pressure drops at the moment the punching waste 15 is discharged at any one of the multiple parts, and the suction and discharge operation cannot be continuously performed.
Suction mechanisms can be installed on all the parts where the punching process is performed, but the mold structure is complicated and it is difficult to realize

Method used

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  • Punched hole processing method of flexible printed circuit lining
  • Punched hole processing method of flexible printed circuit lining
  • Punched hole processing method of flexible printed circuit lining

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] figure 1 ~ FIG. 4 shows an example of the punching process in which the elongated opening is formed by punching in the flexible printed circuit substrate, figure 1 A top view of the bottom mold 12 into which the punching waste 15 formed for punching the elongated opening of the flexible printed circuit substrate enters, figure 2 for the reason figure 1 An enlarged view of the portion surrounded by the dashed line A shown, image 3 to indicate along figure 2 The longitudinal sectional view of the movement of the blanking waste in the bottom die at the X-X line in FIG. 4 is an explanatory plan view showing various shapes of the convex punching part.

[0047] picture Figure 1 ~ Figure 3 As shown, in the punch hole 12 a of the bottom die 12 , one or more convex punching portions 21 are continuously provided at a position near the longitudinal middle portion of the linear elongated opening 20 . The convex punching part 21 can be arranged on any side within 5 mm fr...

Embodiment 2

[0053] Figure 5 ~ FIG. 7 shows another example of punching process for forming elongated openings in flexible printed circuit substrates by punching, Figure 5 A top view of the bottom mold 12 into which the punching waste 15 formed for punching the elongated opening of the flexible printed circuit substrate enters, Figure 6 for the reason Figure 5 FIG. 7 is an enlarged view of the portion surrounded by the dotted line C shown, and FIG. 7 is an explanatory plan view showing the corresponding shape of the concave non-punched portion.

[0054] picture Figure 5 and Figure 6 As shown, in the punch hole 12a of the bottom mold 12 of the second embodiment, a linear elongated opening 30 having a width greater than that of the first embodiment is formed, and the longitudinal middle portion of the elongated opening 30 is In the vicinity, one or more concave non-punched portions 31 are continuously provided toward the inner side. The concave non-punching portion 31 can be provi...

Embodiment 3

[0060] Figure 8 shows an example of the punching process of forming curved elongated openings by punching on the flexible printed circuit substrate, as shown in Figure 8 (1), the punch hole 12a of the bottom mold 12 is gentle One or more convex punching parts 41 are continuously provided in the vicinity of the longitudinal middle part of the elongated opening 40 of the curved punch hole 12a in a curved shape.

[0061] Preferably, the convex punching portion 41 has a rectangular shape in die processing, but it can also be in other shapes such as trapezoid, triangle, sickle shape, semicircle, etc. as in the case of the first embodiment. In addition, the length of the punched portion 41 and the outer corner of the opposite longitudinal side edge portion 42 are also the same as in the case of the first embodiment. As shown in the figure, the convex punching portion 41 is formed outside the curved elongated opening 40 , thereby further effectively suppressing the winding up of the ...

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PUM

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Abstract

The subject of the present invention is that in the punching method of forming the elongated opening in the flexible printed circuit substrate by punching, even if the punch for punching is not inserted from the punching hole of the bottom mold to the position protruding toward the tapered portion In the case of a die with a shorter stroke, the blanking waste does not roll up on the surface of the bottom die, but can be sequentially discharged downward from the tapered portion of the bottom die. In the punch hole (12a) of the bottom die (12) of the punch for punching, a convex shape is continuously provided near the substantially middle portion of the longitudinal side edge (22) of the linear elongated opening (20). Stamping part (21). Since in the convex punching part (21), the part of the length (L) protruding vertically from the side edge part (22) of the elongated opening part is between the bottom die (12) and the blanking waste (15) Since frictional force is generated, winding up of punching waste (15) can be suppressed.

Description

technical field [0001] The present invention relates to a punching method for flexible printed circuit substrates used in electronic equipment, and particularly relates to punching for forming elongated openings such as slits and dividing slits by punching using a punch for punching processing methods. Background technique [0002] As a method of forming non-through holes, openings for receiving electronic components, and the like in a flexible flexible printed circuit board, punching using a punch for punching is widely performed. Usually, a necessary conductor circuit is formed on an insulating substrate with copper foil or the like, covered with a cover layer, a solder resist, etc., and then punched. [0003] In the punching process in the past, it is known that there is a method of inserting a flexible printed circuit substrate between the top mold and the bottom mold, and punching holes while pressing the flexible printed circuit substrate through the pressing plate of...

Claims

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Application Information

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IPC IPC(8): H05K3/00B26F1/14
Inventor 堀切薰一石和博
Owner NIPPON MEKTRON LTD
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