Polyimide semi-interpenetrating network resin and its prepn. method

A technology of semi-interpenetrating network and polyimide, which is applied in the field of engineering plastics, polyimide semi-interpenetrating network resin and its preparation, can solve the problem of high service temperature, achieve wide application fields, high mechanical properties, high The effect of heat resistance

Active Publication Date: 2006-09-13
CHANGCHUN HIPOLYKING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thermoplastic polyimide is easy to process and has outstanding comprehensive performance; thermosetting polyimide has a high service temperature but is brittle

Method used

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  • Polyimide semi-interpenetrating network resin and its prepn. method
  • Polyimide semi-interpenetrating network resin and its prepn. method
  • Polyimide semi-interpenetrating network resin and its prepn. method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Mix 70g of thermoplastic polyimide powder with 30g of bismaleimide powder and 10g of graphite in a high-speed mixer for 2min, and the resulting mixture (hereinafter referred to as the mixture) that can form a semi-interpenetrating network is packed into a mold at Press at 380° C. and 20 MPa to obtain a plate with a thickness of 5 mm.

Embodiment 2

[0022] Mix a solution of 70g thermoplastic polyimide in 600ml cresol with 30g bismaleimide powder and 10g carbon fiber at 120°C for 30min, pour it into 2000ml ethanol, wash the obtained precipitate with cold ethanol 3 times, 70 °C and dried under vacuum to obtain the mixture.

Embodiment 3

[0024] Melt 30g of bismaleimide in a constant temperature bath at 150°C, add 30g of thermoplastic polyimide and 5g of polytetrafluoroethylene powder under stirring, stir for 2 minutes, cool and pulverize to obtain a mixture.

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PUM

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Abstract

The invention belongs to the domain of the polymers technology and is the polyimide half interpenetrating networks pitch and the producing process. With the method of the dry mixing, the wet mixing or the melt mixing, the tri-benzene bis ether polyimide with thermal plasticity is combined with the thermoset bi-smaleimide, then the half interpenetrating networks is formed by the hot pressing. The dosage of the tri-benzene bis ether polyimide is 5-90 percentage and 10-70 percentage optimally. The mixed pitch can be shared with other filler material such as the fraphite, the supramoly, the silicon dioxide, the titanium dioxide, the polyetrafluoroethylene, the carbon fiber and the fibergals in order to improve the ability of the engineering plastic and to satisfy the consumer. Using the high tenacity of the tri-benzene bis ether polyimide with thermal plasticity to reinforce the rigid cross linked structure of the bismaleimide, we can gain the half interpenetrating of the high tenacity and the intension; the material requirement of the different capability needed by a vatiety of purpose can be satisfied by the different mixing methods.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and relates to engineering plastics, in particular to a polyimide semi-interpenetrating network resin and a preparation method thereof. Background technique [0002] Polyimide is currently the engineering plastic with the highest temperature, which can be divided into two types: thermosetting and thermoplastic. Thermoplastic polyimide is easy to process and has outstanding comprehensive performance; thermosetting polyimide has a high service temperature but is relatively brittle. Combining thermoplastic polyimide and thermosetting polyimide can complement each other to obtain engineering plastics with comprehensive properties. Contents of the invention [0003] The present invention uses thermoplastic triphenyl ether type polyimide and thermosetting bismaleimide as raw materials, combines them through dry mixing, wet mixing or melt mixing, and aims to provide a semi-interpenetrating ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08L79/08C08K7/14C08L27/18C08K3/30
Inventor 薛大伟耿丽周建杰丁孟贤
Owner CHANGCHUN HIPOLYKING
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