Method and apparatus for processing dielectric materials

Abstract

A process method and equipment of the dielectric material, spreads the bond glue on the dielectric material layer with several perforations, the fixture loads upward, the pressing groupware above the dielectric material layer pressurizes downward and strickle the bond glue, and the de-aerating equipment allures downward in order to flow the bond glue downward and infill the perforations of the dielectric material layer, spreads the bond glue on the dielectric material layer after strickling the bond glue above the dielectric material layer, forms a well-proportioned film to insure the conductive efficiency and anti-explode board, that is fit for the multilayer board techniques usage.

Description

technical field [0001] The present invention relates to a processing method and device for a dielectric material, in particular to a method of coating a bonding glue on a dielectric material layer provided with several perforations, pressing down with a pressurizing component, and then using a pumping Gas device suction, so that it can fill the perforation of the dielectric material layer, ensure the conductivity efficiency and prevent the dielectric material processing method and device from bursting. Background technique [0002] With the expansion of the mobile phone market and the substantial increase in demand, the vitality of circuit boards has been driven. At present, the circuit boards used in mobile phones can be roughly divided into traditional laminated boards, blind buried via boards and build-up multilayer boards ( Build-up Multilayer, BUM) three kinds, BUM board is currently the highest-level process technology for manufacturing mobile phone boards, that is, th...

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Problems solved by technology

[0003] see Figure 7 As shown, currently HDI boards or mobile phone boards have a large number of blind holes, and the traditional multi-layer board construction method is to blacken / brown oxide the inner layer (inner layer) that has been etched and etched. , add the film e1 and the outer layer copper foil e2 for single pressing, and then carry out drilling, plated through holes and outer layer circuit development and etching, and finally go through the post-processing procedure to complete the finished product of the multilayer board; however, Since the film e1 is composed of epoxy-based resin (Phenoxy) and glass fiber, it often fails to fill the hole e3 reserved by the inner layer circuit e during the lamination process; and the current industry uses In the plug hole method, there is also a lack of stability. When air bubbles appear in the hole, it is not only easy to cause the problem of explosion, but also has a negative impact on the conductivity

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