Power surface mount light emitting die package
A technology of light-emitting chips and mounting pads, which is applied in the direction of circuits, electrical components, and electrical solid devices, and can solve problems such as mechanical stress in packaged components and adverse effects on package reliability.
Active Publication Date: 2006-11-29
CREE HUIZHOU SOLID STATE LIGHTING
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Problems solved by technology
As a result, when these components are heated, each part experiences different degrees of thermal expansion, which causes mechanical stress between the packaged components, which in turn adversely affects the reliability of the package
Method used
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[0036] Reference will now be made to Figures 1 through Figure 10B The invention is described, and the illustrations illustrate different embodiments of the invention. As shown in the figures, the dimensions of layers or regions are exaggerated for illustrative purposes and are thus provided to illustrate the general structure of the invention. Furthermore, various aspects of the invention are described with reference to layers or structures formed on a substrate or other layers or structures. Those skilled in the art will appreciate that a layer formed "on" another layer or substrate means that additional layers may be intervened. Herein, a layer formed on another layer or substrate without intervening layers is described as being "formed directly on" the layer or substrate. In addition, relative terms such as below may be used herein to describe the relationship of one layer or region to another layer or region shown in the drawings. It is to be understood that these term...
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A light emitting die package is disclosed. The die package includes a substrate, a reflector plate, and a lens. The substrate may be made from thermally conductive but electrically insulating material or from a material that is both thermally and electrically conductive. In embodiments wherein the substrate is made from an electrically conductive material, the substrate further includes an electrically insulating, thermally conductive material formed on the electrically conductive material. The substrate has traces for connecting to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad. The lens substantially covers the mounting pad. Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink). The reflector plate includes a reflective surface to direct light from the LED in a desired direction.
Description
[0001] This application is a continuation-in-part of U.S. Patent Application No. 10 / 446,532, filed May 27, 2003, entitled "Power Surface Mount Light Emitting DiePackage," claiming the title of "Power Surface Mount Light Emitting DiePackage," filed September 4, 2002. -SMT, LED Package with Dual Heat-Sinks and an Optical System or Chemical-Coated Lens" priority of U.S. Provisional Application No. 60 / 408,254. technical field [0002] The present invention relates to the field of packaging semiconductor devices, and more particularly to packaging light emitting diodes. Background technique [0003] Light emitting diodes (LEDs) are typically packaged in lead frame packages. Leadframe packages typically include a molded plastic body that encloses the LED, lens portion, and fine metal leads connected to the LED and extending out of the plastic body. The metal leads of the leadframe package act as conduits for supplying power to the LEDs and at the same time can draw heat away from...
Claims
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IPC IPC(8): H01L29/227H01L29/22H01L29/24H01L33/48H01L33/54H01L33/58H01L33/60H01L33/62H01L33/64
CPCH01L33/58H01L33/52H01L2924/01079H01L2924/12041H01L2924/0102H01L2224/48227H01L2924/01078H01L2924/01025H01L33/642H01L33/54H01L33/60H01L33/486H01L2224/48247H01L33/62H01L2224/48091H01L33/64H01L33/641H01L33/647H01L2924/00014H01L33/48
Inventor 彼得·S·安德鲁斯班恩·P·洛
Owner CREE HUIZHOU SOLID STATE LIGHTING