Dielectric paste for spacer layer of multilayer ceramic electronic component

A dielectric and butyral technology, applied in the field of dielectric paste, can solve problems such as deformation and delamination of laminates, and achieve the effect of preventing defects

Inactive Publication Date: 2007-01-03
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the case of laminating a plurality of multilayer units each including a ceramic green sheet and an electrode layer, it is difficult to bond the ceramic green sheets included in the plurality of multilayer units in a desired manner, so that by laminating multiple Laminates fabricated from multilayer units are often deformed and sometimes delaminated

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0125] Preparation of Dielectric Paste for Forming Ceramic Green Sheets

[0126] 1.48 parts by weight of (BaCa)SiO 3 , 1.01 parts by weight Y 2 o 3 , 0.72 parts by weight of MgCO 3 , 0.13 parts by weight of MnO and 0.045 parts by weight of V 2 o 5 Mixing is performed, thereby preparing additive powder.

[0127] 159.3 parts by weight of ethyl cellulose and 0.93 parts by weight of a polyethylene glycol system dispersant were added to 100 parts by weight of the prepared additive powder to prepare a slurry, and the additive contained in the slurry was pulverized.

[0128] When the additives contained in the slurry need to be pulverized, 11.2 grams of slurry and 450 grams of ZrO with a diameter of 2 mm 2 The beads were charged into a polyethylene container with an inner volume of 250 cc, and the polyethylene container was rotated at a peripheral speed of 45 m / min for sixteen hours, thereby pulverizing the additive powder to prepare an additive slurry.

[0129] The median par...

Embodiment 2

[0216] Electrode layers and spacer layers were formed on ceramic green sheets in the same manner as in Working Example 1, except that terpinel oxyethanol was used instead of dihydroterpinel oxyethanol as a solvent for preparing a conductive paste for forming electrode layers and Solvent for preparing the dielectric paste used to form the spacer layer. Then, the surfaces of the electrode layer and the spacer layer were observed at four hundred magnifications by using a metallographic microscope. As a result, it was found that the surfaces of the electrode layer and the spacer layer were free from cracks and wrinkles.

[0217] In addition, fifty ceramic green chips were fabricated in the same manner as in Working Example 1. Then, the side of each ceramic green chip that had been subjected to the baking treatment and annealing treatment was polished, and the polished surface of the ceramic green chip was observed using an optical microscope. As a result, voids were not observed...

Embodiment 3

[0220] Electrode layers and spacer layers were formed on ceramic green sheets in the same manner as in Working Example 1, except that d-dihydrocarveol was used instead of dihydroterpineloxyethanol as a solvent for preparing a conductive paste for electrode layer formation and solvents for preparing the dielectric paste used to form the spacer layer. Then, the surfaces of the electrode layer and the spacer layer were observed at four hundred magnifications by using a metallographic microscope. As a result, it was found that the surfaces of the electrode layer and the spacer layer were free from cracks and wrinkles.

[0221] In addition, fifty ceramic green chips were fabricated in the same manner as in Working Example 1. Then, the side of each ceramic green chip that had been subjected to the baking treatment and annealing treatment was polished, and the polished surface of the ceramic green chip was observed using an optical microscope. As a result, voids were not observed i...

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Abstract

Disclosed is a dielectric paste for spacer layers of multilayer ceramic electronic components, which does not dissolve binders contained in layers adjacent to the spacer layers in multilayer ceramic electronic components, thereby effectively preventing defects in components. The dielectric paste used for the spacer layer contains butyral resin as a binder and also contains dihydroterpinel oxyethanol, terpinel oxyethanol, d-dihydrocarveol, I-carveol At least one solvent selected from the group consisting of pachinyl alcohol, I-perillyl alcohol and acetoxy-methoxyethoxy-cyclohexanol acetate.

Description

field of invention [0001] The present invention relates to a dielectric paste for spacer layers of multilayer ceramic electronic components, and more particularly to insoluble binders contained in layers adjacent to spacer layers of multilayer ceramic electronic components and capable of reliably preventing Dielectric paste for spacer layers of multilayer ceramic electronic components where defects occur in multilayer ceramic electronic components. Background of the invention [0002] Recently, the need to reduce the size of various electronic devices has made it necessary to reduce the size and improve the performance of electronic components incorporated into the devices. Also in multilayer ceramic electronic components such as multilayer ceramic capacitors, there are strong demands to increase the number of layers and to make the laminated units thinner. [0003] When it is necessary to manufacture multilayer ceramic electronic components represented by multilayer cerami...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L29/04C08K5/04H01G4/30H01G4/12H01B3/00C08L29/14C08K5/06C08K5/101C09D129/14H01B1/22H01G4/002H01G4/008
CPCC08K5/101H01B1/22H01G4/30C08K5/06H01G4/12H01G4/0085H01G4/002C09D129/14C08L29/14
Inventor 佐藤茂树野村武史
Owner TDK CORPARATION
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