Heat-resistant resin laminated film, multilayer film with metal layer including same, and semiconductor device
A technology of heat-resistant resin and laminated film, which can be applied to metal layered products, synthetic resin layered products, electronic equipment, etc., can solve problems such as increasing the productivity of processes, etc., and achieve the effect of high reliability
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Problems solved by technology
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Examples
manufacture example 1
[0147] Add 12.43g (0.05mol) of SiDA and 50.05g (0.25mol) of DAE together with 2450g of NMP in a reaction kettle equipped with a thermometer, a dry nitrogen inlet, a heating and cooling device with warm water and cooling water, and a stirring device After dissolving 75.67g (0.7mol) of PDA, 294.2g (1mol) of BPDA was added and reacted at 70°C for 6h to obtain a 15% by weight polyamic acid resin solution (PA1). The linear expansion coefficient of the resin imidated from the polyamic acid resin solution (PA1) was 20 ppm / °C, the water absorption was 1.1% by weight, and the glass transition temperature was 283°C.
manufacture example 2-7
[0149] Except changing the type and addition amount of carboxylic dianhydride and diamine according to Table 1, the same operation was performed as in Production Example 1 to obtain a 15% by weight polyamic acid resin solution (PA2-7). Table 1 shows the coefficient of linear expansion, water absorption, and glass transition temperature of resins imidized from polyamic acid resin solutions (PA2-7).
manufacture example 8
[0151] Except for changing the type and addition amount of carboxylic dianhydride and diamine according to Table 1, the same operation was performed as in Production Example 1 to obtain a 15% by weight polyamic acid resin solution (PA8). Table 1 shows the coefficient of linear expansion, water absorption and glass transition temperature of the resin imidized from the polyamic acid resin solution (PA8).
[0152] Tetracarboxylic acid component
Diamine component
solvent
DMAc
Linear expansion coefficient
(ppm / °C)
water absorption
(weight%)
vitrification
transition temperature
(℃)
BPDA
OPDA
SiDA
DAE
PDA
DABA
m-TB
Manufacturing example 1
PA1
1.00
294.20
0.05
12.43
0.25
50.05
0.70
75.67
2450
20
1.1
283
Manufacturing example 2
PA2
1.00
294.20
0.40
8...
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