Installation system and installation method
An electronic component installation and electronic component technology, which is applied in the direction of assembling printed circuits, electrical components, and electrical components with electrical components, can solve the problems of product quality degradation, solder drying, and flux vaporization, and achieve the effect of preventing product quality decline.
Active Publication Date: 2011-08-03
YAMAHA MOTOR CO LTD
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Problems solved by technology
Therefore, if left in a mounting machine or before a reflow furnace for a long time, solder drying, flux (flux) vaporization, and dust adhesion may occur, resulting in lower product quality
Method used
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[0028] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. figure 1 It is a block diagram showing the mounting system according to this embodiment. In addition, in this embodiment, the same name and code|symbol are used for the same structural element as the conventional mounting system demonstrated in the background art column, and description is abbreviate|omitted suitably.
[0029] The mounting system 1 includes: a substrate supply machine 11 for supplying printed substrates to a production line; a printer 12 for printing solder at a predetermined position on a substrate carried in by the substrate supply machine 11; and a substrate printed with solder by the printer 12 A mounting machine 13 for mounting electronic components on top; a mounting machine 14 for continuing to mount electronic components on the substrate on which the electronic components have been mounted by the mounting machine 13; a reflow furnace 15...
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Provided is a installing system, installing method, installing program, and recording medium which can prevent the deterioration in quality of products. At the time of changing the product type, the packaging system (1) delays the time when a substrate to be changed over to a different product type is carried from a substrate supply machine (11) into a printing machine (12) by a predetermined period of time, considering the set-up change time and the processing time in the printing machine (12), mounting machines (13, 14), and a reflow furnace (15), in order to prevent the substrate which hasbeen printed from waiting. Consequently, the substrate carried into the printing machine does not need to standby in front of each process until it reaches the reflow furnace (15) after leaving the printing machine (12), therefore the time from the printing process to the reflow process can be shortened and the deterioration in quality of products can be prevented.
Description
technical field [0001] The invention relates to an electronic component mounting system for mounting electronic components on a substrate, in particular to a method of printing solder or adhesive on a substrate, mounting electronic components on the printed substrate, and performing a process on the substrate mounted with the electronic components. A mounting system for firing and mounting printed circuit boards on which electronic components are mounted. Background technique [0002] In general, the process of manufacturing a printed circuit board on which electronic components are mounted includes: a process of carrying in the substrate (hereinafter referred to as "carrying process"); a process of printing paste solder on the wiring pattern of the carried substrate process (hereinafter referred to as "printing process"); process of mounting electronic components on printed solder (hereinafter referred to as "mounting process"); heating the substrate on which electronic com...
Claims
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IPC IPC(8): H05K13/04H05K3/34H05K13/08
Inventor 西城洋志小林一裕
Owner YAMAHA MOTOR CO LTD