Electronic component moving device, surface mounting machine and ic automatically conveying device

A technology for electronic components and transfer devices, which is applied to electrical components, electrical components, printed circuits, etc., can solve the problem of not being able to load multiple inspection sockets at the same time for component inspection, and achieve the effect of correcting adsorption deviation and correcting deviation.

Inactive Publication Date: 2007-04-04
I-PULSE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when the position of multiple inspection sockets deviates in a direction different from the direction in which the sucti

Method used

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  • Electronic component moving device, surface mounting machine and ic automatically conveying device
  • Electronic component moving device, surface mounting machine and ic automatically conveying device
  • Electronic component moving device, surface mounting machine and ic automatically conveying device

Examples

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Example

[0086] The first embodiment

[0087] Hereinafter, an embodiment of the electronic component transfer device according to the present invention will be described in detail based on FIGS. 1 to 16. Here, an embodiment when the electronic component transfer device according to the present invention is applied to a surface mounting machine will be described.

[0088] Fig. 1 is a plan view showing the structure of the surface mounter of this embodiment, Fig. 2 is the same side view, Fig. 3 is a plan view showing the structure of the conveyor belt, Fig. 4 is a plan view showing the structure of the suction head unit, and Fig. 5 is the suction head unit Side view. 6 to 8 are cross-sectional views showing the structure of the third drive device, FIG. 6 is a cross-sectional view taken along the line VI-VI in FIG. 5, FIG. 7 is a cross-sectional view taken along the line VII-VII in FIG. 5, and FIG. 8 is a cross-sectional view taken along the line VIII- in FIG. Sectional view of line VIII.

[...

Example

[0192] Example 2

[0193] The electronic component transfer device involved in the present invention, as shown in FIG. 21, can be applied to an IC automatic transfer device.

[0194]FIG. 21 is a plan view showing the structure of an IC automatic transfer device using the electronic component transfer device according to the present invention. In this figure, components that are the same as or equivalent to those described in FIGS. 1 to 12 are denoted by the same reference numerals, and detailed descriptions are appropriately omitted.

[0195] The IC automatic transfer device 210 shown in FIG. 21 includes a plurality of inspection sockets 212 provided on one end of the base 211 (the end in the Y direction in FIG. 21), and four tray lifts provided on the base 211 The table 213, the component recognition camera 214 provided between the lift table 213 and the inspection socket 212, the moving device 215 that moves the suction head unit 4 in the horizontal direction above the base 211,...

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PUM

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Abstract

The present invention provides an electronic component moving device, surface mounting machine and IC automatically conveying device, wherein, the electronic component moving device comprises suction head unit (4, 5) moving along the horizontal direction on the substrate (2) and arranged in specified direction in order to support plurality of suction heads (43-45), and it is equipped with a first driving device (61) for making the first suction head (43) move in Y-direction and a second driving device (71) for making the second and third suction heads (44, 45) in X-direction. At least the synchronous suction or synchronous placing for the electronic component can be actualized more reliably by adopting the present invention, thereby efficiency can be improved.

Description

technical field [0001] The present invention relates to an electronic component transfer device, a surface mounter, and an IC automatic transfer device (IC handler) equipped with a drive device for changing the mutual distance of a plurality of suction nozzles provided on a suction head unit. Background technique [0002] Conventionally, as one of electronic component transfer devices for transferring electronic components, there has been a surface mounter that places and mounts electronic components on predetermined positions on a printed circuit board. As a conventional surface mounter, for example, there is a structure disclosed in Japanese Patent Laid-Open Publication No. 2000-114787 (Patent Document 1). The surface mounting machine disclosed in this patent document 1 includes: a base equipped with a conveyor belt for conveying the above-mentioned printed circuit board, a plurality of tape feeders equipped at the front of the base, and a moving device on the base. A suc...

Claims

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Application Information

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IPC IPC(8): H05K13/04H05K13/00H05K3/00
Inventor 小泽一成
Owner I-PULSE CO LTD
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