Coating apparatus and coating method

Abstract

The invention provides a coating apparatus and a coating method. When a front end of a substrate G approaches a set position (start position for coating) near an area just below a resist nozzle (78), transferring of the substrate is stopped for a second inspection. An optical distance sensor (162) measures distances (Ld, Le) above and below the substrate G. Then, measured values of thickness D of the substrate and floating height Hb are compared to their set values or fiducial values [D] and [Hb]. If absolute values of [D]-D and [Hb]-Hb are within the preset range, 'normal' is obtained, other wise 'abnormal' is obtained. Thus the time for coating the substrate with a treating solution through non-revolving coating method with floating-transferring manner is shortened, the position relationship for heights of a floating table, the substrate and the nozzle is properly managed, and a coating film of the treating solution can be formed with uniform film thickness on the substrate.

Description

technical field [0001] The present invention relates to a coating method and a coating device for coating a liquid on a substrate to be processed to form a coating film. Background technique [0002] In the manufacturing process of a flat panel display (FPD: flat panel display) such as an LCD liquid crystal display, usually in a photolithography process (photolithography process), a long resist nozzle having a groove-shaped discharge port is used to scan, thereby Non-spin coating method for coating a resist solution on a substrate to be processed (glass substrate, etc.). [0003] In this non-rotation coating method, as described in Patent Document 1, the substrate is placed horizontally on a suction-holding type loading table or stage (stage), and the substrate on the stage is combined with a strip-shaped resist. A small gap of about 100 μm is provided between the ejection ports of the nozzles, and the resist liquid is sprayed in a strip while moving the resist nozzle in th...

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Problems solved by technology

Therefore, the time required for scanning at the resist nozzle (T c ), plus the time required to move the unprocessed substrate into and even load it on the stage (T in ), and the time required to unload and carry out the processed substrate from the stage (T out ) and the time required to form a coating treatment cycle (T c +T in +T out ), which becomes the operation time (tact time), there is a problem in shortening the operation time

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