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System and method for electrolytic plating

A technology of electrolyte and electrolyte layer, applied in the direction of electrolysis components, electrolysis process, circuits, etc., can solve the problems of circuit board scrapping, scrapping, dog-bone effect, etc., and achieve good laminar flow and uniform energy transmission

Inactive Publication Date: 2007-05-16
VIASYSTEMS GROUP INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When a plating void is detected in a PCB, the board will be rejected due to an open circuit
[0003] In addition, poor plating distribution can cause "dog-bone" effects or, even worse, scrap the board due to inability to obtain the minimum required plating thickness inside (micro)vias

Method used

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  • System and method for electrolytic plating
  • System and method for electrolytic plating
  • System and method for electrolytic plating

Examples

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Embodiment Construction

[0014] As shown in FIG. 1 , the electrolytic plating apparatus includes a vibrator 11 connected to an upper rod 13 . The upper bar 13 is mounted with a spring system 12 on a rigid bar 14 for supporting the V-shaped saddle of the production line. The spring system 12 prevents vibration energy from being absorbed by the rigid parts of the device.

[0015] The upper rod 13 transmits vibration energy from the vibrator 11 and generates uniform vibration energy to be transmitted to the lower rod 15 . The clamp 16 in which the printed circuit board is fixed is connected to the lower rod 15 as is the flexible current source connecting wire 17 .

[0016] As shown in Figures 1 and 2A-B, the system includes a special floating enclosure) 20 in which the Venturi effect is increased. Electrolyte is supplied through piping 21 to eductor 22 to draw additional electrolyte from the tank.

[0017] As shown in FIGS. 2A-B and 3A-E , the baffles 23 of the floating shroud 20 are formed to enhance...

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Abstract

The present invention includes an electrolytic plating system with an elecrolytic plating bath, means for positioning the printed circuit boards in the bath, and means to alternately generate a laminar flow of electrolyte on each side of the printed circuit boards. A preferred means to alternately generate a laminar flow of electolyte comprises a floating shield with a venturi-shaped partition and an aligned partition below the printed circuit boards, and operating a plurality of eductors below the floating shield. The means to alternately generate a laminar flow of electrolyte can further comprise a transport mechanism that moves the floating shield and its partitions from side to side relative to the eductors or a mechanism to move the eductors. The plating can be also be improved by using a vibrator and a spring-mounting system that prevents vibration energy being absorbed by fixed portions of the plating system.

Description

[0001] This application is a divisional application of the invention patent application No. 02820388.7 (international application number PCT / US02 / 33530) submitted on October 21, 2002. Background technique [0002] For existing printed circuit boards and more advanced technology products, the problem of plating voids and poor plating distribution is becoming more and more difficult due to the increase of aspect ratio. Printed circuit boards are getting thicker and the holes are getting smaller. When a plating void is detected in a printed circuit board, the board is rejected due to an open circuit. [0003] In addition, poor plating distribution can cause a "dog-bone" effect or, even more seriously, scrap the board due to failure to obtain the minimum required plating thickness inside the (micro)vias. [0004] The present electrolytic plating invention attempts to overcome or minimize such problems. Contents of the invention [0005] The present invention provides an electr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/08C25D17/00H05K3/18H05K3/42C25D5/02C25D7/00C25D17/06C25D21/10H05K3/00
CPCC25D5/20C25D17/001C25D7/123B65G49/00H05K3/423C25D5/08C25D5/024C25D5/02H05K3/0088C25D17/00
Inventor H·V·肯彭
Owner VIASYSTEMS GROUP INC