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Front and back stagged double side insert plate back plate

A double-sided plug-in and backplane technology, which is used in the structural connection of printed circuits, devices for connecting/disconnecting components, and printed circuit components, etc., which can solve the problems of upside-down printing on the panel, inconvenient use and maintenance, etc.

Active Publication Date: 2010-05-19
FENGHUO COMM SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

(like image 3 As shown) the defect of this method is that the layout of the connectors on the board is limited, and it can only be concentrated on half of the board. The board is rotated 180 degrees, and it may appear that the front and rear panels are printed upside down after the front and rear insertions, which is inconvenient to use and maintain

Method used

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  • Front and back stagged double side insert plate back plate
  • Front and back stagged double side insert plate back plate
  • Front and back stagged double side insert plate back plate

Examples

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Embodiment Construction

[0023] In the design of the equipment chassis, the front chassis and the rear chassis are staggered up and down by a certain height, and the front and rear chassis are not separated from each other in the horizontal direction, and are staggered by a certain height in the vertical direction. The front frame and the rear frame share the same PCB (printed circuit) backplane, and the front and back of the backplane are respectively equipped with a connector connected to the front board and a connector connected to the rear board. The position of the front board connector on the backplane is exactly the same as that of the rear board connector in the horizontal direction, and they are staggered up and down by a certain height in the vertical direction. The positions of the front board connectors and the rear board connectors on the backplane are completely staggered up and down and inserted into each other. The connectors on the backplane connected to the front board and the connec...

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Abstract

The invention relates to a backplane of an alternate duplex gusset, which is demanded that there should be a certain height difference in vertical direction between the front and back single-gusset. The connector of the front gusset and the connector of the back gusset on the backplane are exactly same. The layout and direction of the described connectors on the backplane are exactly same. The definition for pins is same except there is a alternate difference in the relative vertical position. The invention of this double-interpolation backplane can be achieved by using common backplane connectors.

Description

technical field [0001] The invention relates to communication equipment, especially high-speed, large-capacity communication equipment, including optical communication equipment, data exchange equipment, etc., specifically, the invention relates to a double-sided plug-in backplane with front and rear staggered layers. Background technique [0002] In the optical communication system, with the continuous improvement of the communication rate, the access capacity of the single-ended equipment is increasing. At present, the access capacity of the single-ended equipment of the 10Gb / s optical transmission system can reach 320G or even higher. The maximum access capacity of single-ended equipment in a 40Gb / s optical transmission system can reach more than 640G. There are two main methods to achieve such a large access capacity: one is to improve the integration of equipment and reduce the distance between boards ; Another method is to adopt the structure of inserting single boards...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04Q1/18H01R12/18H01R13/62H05K1/14H01R12/73
Inventor 吕建新
Owner FENGHUO COMM SCI & TECH CO LTD
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