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Via architecture of printed circuit board

A printed circuit board and via hole technology, which is applied in the field of printed circuit board via hole structure, can solve the problems affecting the future design layout and wiring requirements of micro electronic circuits, waste printed circuit board materials, etc., to achieve cost advantages and reduce materials. effect used

Inactive Publication Date: 2007-07-04
HTC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This not only affects the layout and wiring requirements of the future finepitch design, but also wastes the material of the printed circuit board

Method used

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  • Via architecture of printed circuit board
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  • Via architecture of printed circuit board

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Embodiment Construction

[0021] The invention discloses a through-hole structure of a printed circuit board that allows multiple groups of signals to be interconnected between layers at the same time. The present invention divides the conventional single via hole into a plurality of separate and independently operating blocks, so as to realize conduction and transmission of multiple groups of signals with a single via hole area.

[0022] Referring to FIGS. 2A and 2B at the same time, it shows a schematic diagram and a top view of a preferred embodiment of a via hole structure of a printed circuit board according to the present invention. The through hole of the printed circuit board of the present invention mainly includes an insulating layer having a first surface (202a) and a second surface (202b), a bare through hole 280 and a plurality of conducting layers 214, 224 in the hole. The in-hole conduction layers 214 and 224 are attached to the hole walls of the bare through-hole 280 , and the in-hole c...

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Abstract

The invention relates to a through hole of printed circuit board, wherein it comprises one insulated layer with first and second faces, one exposed through hole and several internal connecting layers; the exposed through hole is through the first and second faces of insulated layer; the internal connecting layers connected on the hole walls of exposed through hole are separated from each other and insulated electrically; therefore, the invention has use one through hole to transmit different signals between base board layers.

Description

【Technical field】 [0001] The present invention relates to a via hole structure, and in particular to a via hole structure of a printed circuit board with the function of transmitting multiple sets of signals. 【Background technique】 [0002] With the vigorous development of the electronic industry, electronic products have gradually entered the research trend of multi-function and high performance, and the product should be light, thin and short. One of the problems encountered in the development of today's electronic products that require multiple functions is that electronic circuits will become more and more complex. In order to design this complex electronic circuit into the printed circuit board, the space configuration must be limited, and it is difficult to achieve the characteristics of light, thin, short, and small products. The traditional via hole design is difficult to achieve this special feature. space requirements. [0003] FIG. 1 is a schematic diagram of a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K2201/09645H05K3/42H05K1/115
Inventor 何锦玮
Owner HTC CORP
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