Silicon substrate for magnetic recording medium, method of manufacturing the silicon substrate, and magnetic recording medium
A technology of a magnetic recording medium and a manufacturing method, applied to the base layer of the recording layer, the magnetic recording, the magnetic recording layer, etc., can solve the problems of reducing the recordable area, the recording capacity of the ultra-small size magnetic recording medium, and increasing the cost, etc.
Inactive Publication Date: 2007-07-04
RESONAC HOLDINGS CORPORATION
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[0019] However, in this method, chamfering and grinding processes are performed for each substrate; therefore, considerable time and labor are required, thereby increasing costs
[0020] In addition, when the chamfered portion is formed in the end face of the substrate, the recordable area on the main surface is reduced, which is not preferable for securing the recording capacity required for an ultra-small-sized magnetic recording medium
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[0097] Twenty silicon substrates each having a diameter of 21.6 mm (referred to as "0.85 inch") and twenty silicon substrates each having a diameter of 25.4 mm (referred to as "1 inch") were prepared. These substrates were sequentially subjected to the above-described series of processes, namely, the first grinding step, the second grinding step, the step of forming a circular hole, the step of chamfering the inner and outer peripheral end faces, the step of brush-polishing the inner and outer peripheral end faces, and the second polishing of the main surface. A polishing step and a second polishing step on the major surface. Thus, a silicon substrate having a curved surface with a radius of 0.01 mm to 0.05 mm at the corners of the outer peripheral side and the inner peripheral side of each main surface was obtained.
[0098] In the steps of grinding (i.e., chamfering) and brush-polishing the inner and outer peripheral end faces, a laminated body of silicon substrates is used,...
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Abstract
In a silicon substrate for a magnetic recording medium, a curved surface having a radius from 0.01 mm to 0.05 mm is provided at an edge portion between a main surface and an end face of the substrate. The curved surface may be provided at an outer periphery or an inner periphery of the substrate. Preferably, the maximum heights for surface roughness for the end face and the main surface are respectively 1 m or less and 10 nm or less. A manufcturing method for a silicon substrate includes forming a circular hole at a center of the silicon substrate; immersing the substrate in a polishing liquid in which grains are suspended; and respectively polishing outer and inner peripheral end faces of the substrate. In polishing of each end face, a polishing brush contacts the end face while performing a relative rotation between the end face and the polishing brush.
Description
technical field [0001] The present invention relates to a silicon substrate for a small-sized magnetic recording medium used as a recording medium of a data processing device. [0002] Priority is claimed from Japanese Patent Application 2004-236580, filed August 16, 2004, and US Provisional Patent Application 60 / 603,565, filed August 24, 2004, the contents of which are incorporated herein by reference. Background technique [0003] With recent advances in data processing devices, the data recording capacity of magnetic recording media is increasing. Specifically, in magnetic disks, which are important media for external memories of computers, storage capacity and data recording density are increasing every year, and thus developments to record data at higher densities are required. For example, according to the development of notebook computers or palmtop computers, small-sized and impact-resistant magnetic recording media are required, and thus small-sized magnetic record...
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IPC IPC(8): G11B5/73G11B5/84
CPCG11B5/8404G11B5/7315G11B5/73911
Inventor 会田克昭
Owner RESONAC HOLDINGS CORPORATION