Retaining ring of a wafer carrier
a technology of retaining ring and wafer, which is applied in the direction of grinding machine components, manufacturing tools, abrasive surface conditioning devices, etc., can solve the problem of not simplifying the total polishing operation
Inactive Publication Date: 2002-10-24
SILICON INTEGRATED SYST CORP SCI BASED IND PARK
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- Abstract
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Benefits of technology
[0011] Another objective of the invention is to provide a retaining ring of a wafer carrier, which can reduce the time in replacing the polishing slurry and simplify the polishing operation as a whole so as to reduce the cost and to promote productive efficiency.
[0014] In addition, unlike prior art, it is possible to directly replace the retaining ring without replacing the polishing slurry or cleaning the pipe of the polishing slurry supply mechanism if one simply wants to replace the abrasives. Even though it is necessary to replace the polishing slurry and to clean the pipe of the polishing slurry supply mechanism, the time needed for replacing or cleaning will be shorter, since no abrasive aggregation occurs in the polishing slurry supply mechanism. Therefore, the time for replacing the polishing slurry is greatly reduced and the polishing operation as a whole can be simplified so as to reduce the cost and promote productive efficiency.
Problems solved by technology
Though the PPS retaining ring 313 is convenient in maintaining the wafer 5, however, it does not simplify the total polishing operation.
Method used
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[0021] In the following, a preferred embodiment according to the invention will be described in detail with reference to FIGS. 4A and 4B. Before describing it, it is intended to point out that the same referential numerals shown in FIGS. 1, 2 and 3 are also adopted herein to indicate the similar elements for the sake of convenience in describing similar elements.
[0022] With reference to FIGS. 4A and 4B, the retaining ring 313' of a wafer carrier 3 in accordance with the invention is applied to maintain a wafer 5 on a wafer carrier 3. The retaining ring 313' is formed of a polymer containing abrasives therein. In this embodiment, suitable abrasives for forming the retaining ring 313' include SiO.sub.2, Al.sub.2O.sub.3 and CeO.sub.2.
[0023] With the retaining ring 313' according to the invention, the abrasives contained in the retaining ring 313' will be released by the friction between the retaining ring 313' and the polishing pad 2. Therefore, it is not necessary to add any abrasive ...
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A retaining ring of a wafer carrier includes a polymer containing abrasives. The abrasives can be released from the polymer by the friction between the polymer and the polishing pad. Therefore, it is convenient to maintain the wafer and is possible to prevent abrasives from aggregating in the polishing slurry. Meanwhile, the time for replacing the polishing slurry can be reduced and the polishing operation as a whole can be simplified so as to reduce the cost and promote productive efficiency.
Description
[0001] A. Field of the Invention[0002] The invention relates to a retaining ring of a wafer carrier, and especially to a retaining ring of a wafer carrier applicable to a chemical-mechanical polishing (CMP) apparatus.[0003] B. Description of the Related Art[0004] With reference to FIG. 1, a conventional CMP apparatus essentially includes a polishing platen 1 for performing the wafer polishing, a polishing pad 2 mounted on the polishing platen 1, a wafer carrier 3 for maintaining a wafer 5 to be polished and a polishing slurry supply mechanism 4 for supplying polishing slurry 6.[0005] The wafer carrier 3 essentially includes a polish head 31 and a spindle 32. As shown in FIG. 2, the polish head 31 includes a polish head body 311, a membrane 312 and a retaining ring 313.[0006] As shown in FIG. 3, most of the conventional retaining rings 313 are made of Teflon. Because the retaining ring 313 made of Teflon will have a relatively higher hardness, it is necessary to slightly extend the s...
Claims
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IPC IPC(8): B24B37/32B24B53/007B24B53/017
CPCB24B53/017B24B37/32
Inventor KUO, CHIA-MINGHUANG, CHAO-YUAN
Owner SILICON INTEGRATED SYST CORP SCI BASED IND PARK