High density SRAM cell with latched vertical transistors

Abstract

High density static memory cells and arrays containing gated lateral bipolar transistors which can be latched in a bistable on state. Each transistor memory cell includes two gates which are pulse biased during the write operation to latch the cell. Also provided is a CMOS fabrication process to create the cells and arrays.

Description

[0001] This application is a divisional application of application Ser. No. 10 / 795,516, filed Mar. 9, 2004, which is a divisional of application Ser. No. 09 / 750,111, filed Dec. 29, 2000, which is a divisional of application Ser. No. 09 / 076,728, filed May 13, 1998, now Pat. No. 6,225,165, issued May 1, 2001. The entirety of each application and patent is incorporated herein by reference.FIELD OF THE INVENTION [0002] This invention relates generally to non-volatile static memory devices. Particularly, this invention relates to a high density Static Random-Access Memory (SRAM) cell taking advantage of the latch-up phenomenon in a Complementary Metal Oxide Semiconductor (CMOS). BACKGROUND OF THE INVENTION [0003] One known type of static read / write memory cell is a high-density static random access memory (SRAM). A static memory cell is characterized by operation in one of two mutually-exclusive and self-maintaining operating states. Each operating state defines one of the two possible b...

AI Technical Summary

Benefits of technology

This approach results in area-efficient static memory cells and arrays with reduced power consumption and increased packing density, while minimizing process complexity and fabrication costs, and effectively mitigating latchup issues.

Problems solved by technology

Without refreshing, the output of a dynamic memory cell will drift toward intermediate or indeterminate voltages, resulting in loss of data.

One of the limitations of static memory cells utilizing both n-channel and p-channel devices (CMOS SRAMS) is their exceptionally large cell areas, typically over 100 F2, where F is the minimum feature size.

However, increased process complexity, extra masks, and high fabrication cost are required and the corresponding product yield is not high.

Extra processing steps and increased masks are required, along with special deep isolation techniques, resulting in high fabrication cost and process complexity.

Yield of SRAM products utilizing such complex processes is usually low compared with the existing CMOS processes.

A problem with CMOS circuits in general is their propensity to “latchup.” Latchup is a phenomenon that establishes a very low-resistance path between the VDD and VSS power lines, allowing large currents to flow through the circuit.

This can cause the circuit to cease functioning, or even to destroy itself due to heat damage caused by high power dissipation.

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