Air mover for improved cooling of electronics
a technology of air mover and electronics, which is applied in the direction of positive displacement liquid engine, pump components, piston pumps, etc., can solve the problems of increasing the specific surface area, reducing the heat that can be rejected, and increasing the pressure required in the air flowing past the heat exchanger
Inactive Publication Date: 2006-11-02
MECHANOLOGY INC
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Benefits of technology
[0005] Accordingly, it is an object of this invention to provide a low pressure, high air flow compressor or air blower for use in electronics and similar a
Problems solved by technology
The problem is that, as one reduces the size of the heat exchanger, one either reduces the heat exchanger surface area, or increases the specific surface area of the heat exchanger.
This, in turn, either reduces the amount of heat that can be rejected, or increases the pressure required in the air flowing past the heat exchanger.
In order to use fans and blowers the pressure drop through the heat sink must be very small, and maintaining this low pressure drop has been the dominant constraint on heat exchanger design, limiting the practical level of heat exchanger density that can be achieved.
In addition to the size constraint imposed on electronics cooling equipment by the continuous reduction in the size of electronic products, many of these products that require cooling have also seen their heat loads increase over time.
One method of increasing the effectiveness of the heat exchanger is to increase the density of the heat exchange media, but this approach has not been explored in the electronics cooling art due to a lack of suitable air moving technology that can produce the appropriate flows of air at higher pressures than blowers and fans or higher flows than compressors.
Fans and blowers on the other hand may have very high flow to weight ratios, but can only generate a few thousand Pascals over atmospheric pressure.
The constraint placed on air moving technology for electronics cooling are severe.
This combined with the fact that cooling technology was seen as an ancillary rather than a strategic, or enabling technology, has also kept research and development investment, and innovation, low.
Method used
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Embodiment Construction
[0006] The compressor of the invention is a low-pressure compressor. As used herein low pressure is defined as less than 500,000 Pascals. Preferably low pressure is less than 110,000 Pascals. Air pressures provided for the purposes of cooling electronic components are typically very low, in the range from about 0.005 to about 0.01 atm. In one embodiment, the low-pressure compressor can provide pressurized air at pressure of greater than 100 mm of water (100 mm water equals 0.01 atm). In addition to raising the output pressure from the air mover, it is also important that the specific flow (l / s / kg) also remain as high as possible.
[0007] Current expected air requirements for different computer applications include an air flow between about 3-6 L / min at about 0.01-0.015 atm for a mobile personal computer; between about 5-10 L / min at about 0.015-0.03 atm for a desktop personal computer; and between about 10-20 L / min at about 0.025-0.05 atm for a performance computer. The compressor of ...
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The invention provides a low pressure, high air flow compressor or air blower for use in electronics and similar applications. In a preferred embodiment, the compressor is a toroidal intersecting vane machine, or compressor.
Description
RELATED APPLICATIONS SECTION [0001] This application is related to U.S. application No. of 60 / 591,254, filed on Jul. 26, 2004, and claims benefit of priority to U.S. Application 60 / 669,115 filed on Apr. 7, 2005, the teachings of which are incorporated herein by reference.BACKGROUND OF THE INVENTION [0002] As electronic devices get smaller and, it becomes desirable to reduce the size of heat sinks and heat exchangers used to cool these devices. Although liquids and phase change materials may be used to transfer heat away from the sources of heat in these devices, ultimately the heat must be rejected to a larger sink, such as the atmosphere, and must therefore be transferred to the air. Consequently, it is necessary to reduce the size of heat exchangers. The problem is that, as one reduces the size of the heat exchanger, one either reduces the heat exchanger surface area, or increases the specific surface area of the heat exchanger. This, in turn, either reduces the amount of heat tha...
Claims
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Login to View More IPC IPC(8): F04B17/00
CPCF04C2220/10F01C3/025
InventorINGERSOLL, ERIC
OwnerMECHANOLOGY INC