Implantable capacitive pressure sensor system and method

Abstract

Embodiments of the invention provide systems and methods for an implantable capacitive pressure sensor. Some embodiments of the invention include a capacitive pressure sensor capsule comprising a substrate, a conductive plate functionally coupled to the substrate, a conductive diaphragm spaced from the conductive plate and functionally coupled to the substrate, a lid hermetically sealed against the substrate, and pressure sensing circuitry disposed within a volume generally defined by the lid and the substrate. Embodiments of the invention also include a lead provided with an implantable pressure sensor capsule and a method of manufacturing a capacitive pressure sensor capsule.

Description

FIELD SECTION [0001] The disclosure relates to an implantable capacitive pressure sensor system and method. BACKGROUND SECTION [0002] Pressure sensors may be implanted into a patient for temporary or chronic use in a body organ or vessel. Implantable pressure sensors are useful for sensing blood pressure in a heart chamber. Traditionally, such pressure sensors had circuitry components in a housing separate from the sensor. This design caused the sensors to be relatively large because of the additional housing and associated interconnects between the sensor and the circuitry. Therefore, greater space was required within the organ or vessel. Further, such sensors have been designed such that they could generally not be manufactured by mass-production techniques. BRIEF SUMMARY SECTION [0003] Some embodiments of the invention include an implantable capacitive pressure sensor capsule comprising a substrate, a conductive plate functionally coupled to the substrate, a conductive diaphragm ...

AI Technical Summary

Benefits of technology

[0003] Some embodiments of the invention include an implantable capacitive pressure sensor capsule comprising a substrate, a conductive plate functionally coupled to the substrate, a conductive diaphragm spaced from the conductive plate and functionally coupled to the substrate, a lid hermetically sealed against the substrate, and pressure sensing circuitry disposed within a volume generally defined by the lid and the substrate. Embodiments of the invention also include a lead

Problems solved by technology

This design caused the sensors to be relatively large because of the additional housing and associated interconnects between the sensor an

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