Solid state light sheet and encapsulated bare die semiconductor circuits

Abstract

An electronically active sheet includes a bottom substrate having a bottom electrically conductive surface. A top substrate having a top electrically conductive surface is disposed facing the bottom electrically conductive surface. An electrical insulator separates the bottom electrically conductive surface from the top electrically conductive surface. At least one bare die electronic element is provided having a top conductive side and a bottom conductive side. Each bare die electronic element is disposed so that the top conductive side is in electrical communication with the top electrically conductive surface and so that the bottom conductive side is in electrical communication with the bottom electrically conductive surface.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a continuation-in-part application of U.S. Utility application Ser. No. 11 / 454,479, entitled Solid State Light Sheet and Bare Die Semiconductor Circuits with Series Connected Bare Die Circuit Elements, which is a continuation-in-part application of U.S. Utility application Ser. No. 11 / 029,129, entitled Roll-to-Roll Fabricated Light Sheet and Encapsulated Semiconductor Circuit Devices filed Jan. 4, 2004, and U.S. Utility application Ser. No. 11 / 029,137, entitled Roll-to-Roll Fabricated Light Sheet and Encapsulated Semiconductor Circuit Devices filed Jan. 4, 2004, both of which are continuation-in-part applications of U.S. Utility application Ser. No. 10 / 919,830, entitled Light Active Sheet And Methods For Making The Same, filed Aug. 17, 2004, now U.S. Pat. No. 7,052,924, issued May 30, 2006, and which is a U.S. Utility application of U.S. Provisional Application Ser. No. 60 / 556,959, filed Mar. 29, 2004.BACKGROUND OF T...

AI Technical Summary

Benefits of technology

[0110] In accordance with the present invention, a method of making a photo-radiation source is provided. A first planar conductor is provided and a formation of light emitting dice formed on the first planar conductor. Each die has a cathode and an anode. One of the cathode and anode of each die is in contact with the first planar conductor. A second planar conductor is disposed on top of the formation of light emitting dice, so that the second planar conductor is in contact with t

Problems solved by technology

The conversion of an LED die into an LED lamp is a costly process, involving very precise handling and placement of the tiny LED die.

The cost of forming the lamp and then soldering the lamp to a printed circuit board is a relatively expensive process.

Among the drawbacks of the conventional systems that utilize photo-polymerizable organic materials is the requirement of a high intensity photo-radiation source.

However, these light sources are an inefficient radiation source because most of the energy put in to drive the lamp is wasted as heat.

This heat must be removed from the system, increasing the overall bulk and cost.

Also, the lamps have relatively short service life-times, typically around 1000 hours, and are very costly to replace.

Much of the light output is wasted.

This UV radiation is harmful to humans, and additional shielding and protective precautions such as UV-filtering goggles are needed to protect the operators of such equipment.

It is very difficult to manufacture these conventional lamps due to the very small size of the die, and the need to solder or wire bond such a small wire to such a small die electrode.

Further, the plastic lens material is a poor heat conductor and the cup prov

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