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Method and system for high volume transfer of dies to substrates

a technology of dies and substrates, applied in the field of electronic devices, can solve the problems limited placement accuracy of pick and place techniques, and drawbacks of limiting throughput volum

Inactive Publication Date: 2007-05-17
SYMBOL TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Pick and place techniques involve complex robotic components and control systems that handle only one die at a time.
This has a drawback of limiting throughput volume.
Furthermore, pick and place techniques have limited placement accuracy, and have a minimum die size requirement.

Method used

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  • Method and system for high volume transfer of dies to substrates
  • Method and system for high volume transfer of dies to substrates
  • Method and system for high volume transfer of dies to substrates

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Embodiment Construction

[0029] This specification discloses one or more embodiments that incorporate the features of this invention. The embodiment(s) described, and references in the specification to “one embodiment”, “an embodiment”, “an example embodiment”, etc., indicate that the embodiment(s) described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.

1.0 Overview

[0030] The present invention provides improved processes and systems for assembling electronic devices, including RFID tags. The present ...

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PUM

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Abstract

A method, system, and apparatus for transferring dies to respective substrates is described. Conventional techniques include vision-based systems that pick and place dies one at a time onto substrates. The present invention can transfer multiple dies simultaneously or consecutively. Dies are loaded in a channel of a die application device. The dies are moved through the channel using any of a variety of means, such as gravity, air, vibration, a brush, a spring, etc. The die application device dispenses the dies onto respective substrates. In an aspect, the die application device independently dispenses each of the dies. In another aspect, the die application device dispenses multiple dies at a time.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates generally to the assembly of electronic devices. More particularly, the present invention relates to the transfer of dies from wafers to substrates, including substrates of radio frequency identification (RFID) tags. [0003] 2. Related Art [0004] Pick and place techniques are often used to assemble electronic devices. Such techniques involve a manipulator, such as a robot arm, to remove integrated circuit (IC) dies from a wafer and place them into a die carrier. The dies are subsequently mounted onto a substrate with other electronic components, such as antennas, capacitors, resistors, and inductors to form an electronic device. [0005] Pick and place techniques involve complex robotic components and control systems that handle only one die at a time. This has a drawback of limiting throughput volume. Furthermore, pick and place techniques have limited placement accuracy, and have a minim...

Claims

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Application Information

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IPC IPC(8): B21D39/03
CPCH01L21/67144Y10T29/49826H01L21/6838H01L2224/10
Inventor ADDISON, DAVIDSTEINMETZ, TRAVIS
Owner SYMBOL TECH INC
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