Method and system for high volume transfer of dies to substrates

Abstract

A method, system, and apparatus for transferring dies to respective substrates is described. Conventional techniques include vision-based systems that pick and place dies one at a time onto substrates. The present invention can transfer multiple dies simultaneously or consecutively. Dies are loaded in a channel of a die application device. The dies are moved through the channel using any of a variety of means, such as gravity, air, vibration, a brush, a spring, etc. The die application device dispenses the dies onto respective substrates. In an aspect, the die application device independently dispenses each of the dies. In another aspect, the die application device dispenses multiple dies at a time.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates generally to the assembly of electronic devices. More particularly, the present invention relates to the transfer of dies from wafers to substrates, including substrates of radio frequency identification (RFID) tags. [0003] 2. Related Art [0004] Pick and place techniques are often used to assemble electronic devices. Such techniques involve a manipulator, such as a robot arm, to remove integrated circuit (IC) dies from a wafer and place them into a die carrier. The dies are subsequently mounted onto a substrate with other electronic components, such as antennas, capacitors, resistors, and inductors to form an electronic device. [0005] Pick and place techniques involve complex robotic components and control systems that handle only one die at a time. This has a drawback of limiting throughput volume. Furthermore, pick and place techniques have limited placement accuracy, and have a minim...

AI Technical Summary

Problems solved by technology

Pick and place techniques involve complex robotic components and control systems that handle only one die at a time.

This has a drawback of

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